Breaking Down Memory Barriers to Your Innovation
With HMC, you can move data up to 15 times faster than with a DDR3 module and use up to 70% less energy and 90% less space than with existing memory technologies. And HMC’s abstracted interface and advanced reliability, availability, and serviceability (RAS) capabilities reduce complexity and deliver greater reliability—enabling your innovation and lowering your total cost of ownership like never before.
Samples of our 2GB device are now available. Samples of the 4GB device will be available in 2014.
||Memory Bandwidth (MAX)
- Increases bandwidth
- Reduces power
- Increases reliability with RAS features
- Simplifies design with abstracted memory
- Lowers TCO
31 x 31, 896-ball BGA
16 x 19.5, 666-ball FBGA
120 GB/s, 160 GB/s