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Micron Products

Hybrid Memory Cube

With HMC, you can move data up to 15 times faster than with a DDR3 module and use up to 70% less energy and 90% less space than with existing memory technologies. And HMC’s abstracted interface and advanced reliability, availability, and serviceability (RAS) capabilities reduce complexity and deliver greater reliability—enabling your innovation and lowering your total cost of ownership like never before.

By Technology

Technology Benefits Densities Package Memory Bandwidth (MAX)
Short-Reach HMC
  • Increases bandwidth

  • Reduces power

  • Increases reliability with RAS features

  • Simplifies design with abstracted  memory

  • Lowers TCO

2GB, 4GB

31 x 31, 896-ball BGA

16 x 19.5, 666-ball FBGA

120 GB/s, 160 GB/s


Featured Video

Hybrid Memory Cube Gains Traction

The Much Anticipated Physical Roll-out of Micron's Hybrid Memory Cube at the annual Supercomputing Conference.