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DDR3 SDRAM Technical Notes

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DRAM Components

Technical Notes

File Title and Description ID Number Last Update Software Downloads
pdf Calculating Memory System Power For DDR3 - Details how DDR3 SDRAM consumes power and provides the tools that system designers can use to estimate power consumption. TN-41-01 Aug 2007
pdf DDR3 Termination Data Strobe - Provides guidelines for using the TDQS feature to reduce signal integrity issues associated with mismatched DQS loading in in combined x4-based/x8-based systems TN-41-06 Mar 2008
pdf TN-00-01: Moisture Absorption in Plastic Packages - Describes the shipping procedures that ensure Micron’s customers receive memory devices that do not exhibit the popcorn effect TN-00-01 Mar 2007
pdf TN-00-06: Bypass Capacitor Selection for High-Speed Designs TN-00-06 Sep 1999
pdf TN-00-07: IBIS Behavioral Models TN-00-07 Sep 1999
pdf TN-00-08: Thermal Applications - Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature. TN-00-08 Feb 2007
pdf TN-00-14: Understanding the Quality and Reliability Requirements for Bare Die Applications TN-00-14 Sep 2001
pdf TN-00-15: Recommended Soldering Parameters TN-00-15 Mar 2007
pdf TN-00-17: Timing Specification Derating for High Capacitance Output Loading - Describes how to create capacitance derating data for Micron products that can then be used in preliminary evaluations of system timing TN-00-17 May 2004
pdf TN-00-18: Uprating of Semiconductors for High-Temperature Applications - Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications TN-00-18 Feb 2007
pdf TN-00-19: Thinning Considerations for Wafer Products - Information on optimal wafer-thinning processes to meet specific customer requirements TN-00-19 Nov 2004
pdf TN-00-20: The Value of Signal Integrity - Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 Jun 2005
pdf TN-41-02: DDR3 ZQ Calibration - Describes how the DDR3 SDRAM driver design has been enhanced TN-41-02 Feb 2008
pdf TN-41-04: DDR3 Dynamic On-Die Termination - With DDR3, dynamic ODT provides systems with increased flexibility to optimize termination values for different loading conditions. TN-41-04_PDF Mar 2008