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PC28F512M29EWHD

Data Sheets (1)

Data Sheet
Data Sheet Updated 09/2014

Specs

Orderable Parts for: PC28F512M29EWHD
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
PC28F512M29EWHD Contact Factory Dry Pack N/A N/A N/A Yes 05/04/2011 N/A
Detailed Specifications
Product Name Axcell Component Density 512Mb Part Status Code Contact Factory RoHS Yes
Depth Bus Width x8/x16 Voltage 2.7V-3.6V Package FBGA
Pin Count 64-ball Clock Rate Industry Speed Cycle Time (min)
Operating Temp -40C to +85C

Sim Models & Software

Sim Model (4)
Software (1)
Title & Description Updated Type
M29EW (32Mb, 64Mb, 128Mb, 256Mb, 512Mb, 1Gb, 2Gb) General Low-Level Driver (zip) General low-level driver for M29EW parallel NOR. Download the technical note for this driver here.
(Parallel NOR)
07/2010 Software Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (20)
Title & Description Updated Type
Technical Note: LPDDR2 Dual Die Package to Single Die Package Migration (pdf) This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
(TN-42-02)
12/2014 Technical Note Add Email
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Partial Array Self Refresh (PASR) (pdf) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.
(E0597E10)
02/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Deep Power Down (DPD) (pdf) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.
(E0598E21)
02/2014 Technical Note Add Email
Technical Note: Recommended Soldering Conditions & Storage Conditions (pdf) This document shows referential examples of recommended soldering and storage conditions for DRAM products provided by Elpida Memory, Inc.
(E0591E22)
02/2014 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
DRAM Design Analysis Kits (html) The platform-independent storage module PISMO™ specifications address these issues by providing a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email

Parts with the same Data Sheet (40)

PC28F512M29EWHD ( Current ) PC28F00BM29EWHA TE28F256M29EWLA JS28F256M29EWHA JS28F256M29EWLA JS28F256M29EWLB PC28F256M29EWHA PC28F256M29EWLD PC28F256M29EWLB PC28F256M29EWLA PC28F256M29EWHD PC28F256M29EWHB RC28F256M29EWHA RC28F256M29EWLA RC28F256M29EWHB JS28F256M29EWHB JS28F512M29EWHA JS28F512M29EWLB JS28F512M29EWLA JS28F512M29EWHB RC28F512M29EWHA RC28F512M29EWLA RC28F512M29EWHB PC28F512M29EWHA PC28F512M29EWLB PC28F512M29EWLA PC28F512M29EWHE PC28F512M29EWHB JS28F00AM29EWHA JS28F00AM29EWLA JS28F00AM29EWHB PC28F00AM29EWHA PC28F00AM29EWLE PC28F00AM29EWLA PC28F00AM29EWHD PC28F00AM29EWHB RC28F00AM29EWHA RC28F00AM29EWLA RC28F00AM29EWHB RC28F00BM29EWHA PC28F512M29EWLE
Part Status Code Contact Factory Contact Factory Obsolete Production Production Production Production End of Life End of Life Production Production Production Contact Factory Contact Factory Contact Factory Production Contact Factory Contact Factory Contact Factory Contact Factory End of Life Contact Factory End of Life Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory End of Life Contact Factory End of Life Contact Factory End of Life End of Life End of Life
Product Name Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell
Component Density 512Mb 2Gb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 512Mb
RoHS Yes Yes No Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No Yes Yes Yes Yes Yes No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No No Yes
Depth
Bus Width x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16
Voltage 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V
Package FBGA FBGA TSOP TSOP TSOP TSOP FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA TSOP TSOP TSOP TSOP TSOP FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA TSOP TSOP TSOP FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
Pin Count 64-ball 64-ball 56-pin 56-pin 56-pin 56-pin 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 56-pin 56-pin 56-pin 56-pin 56-pin 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 56-pin 56-pin 56-pin 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball
Clock Rate
Industry Speed
Cycle Time (min)
Operating Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
PC28F512M29EWHD Contact Factory Dry Pack N/A N/A N/A Yes 05/04/2011 N/A
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