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M29W256GL70N6E

Data Sheets (1)

Data Sheet
Data Sheet Updated 07/2013

Specs

Orderable Parts for: M29W256GL70N6E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
M29W256GL70N6E Production Dry Pack N/A N/A N/A Yes 05/04/2011 N/A
Detailed Specifications
Product Name Axcell Component Density 256Mb Part Status Code Production RoHS Yes
Depth Bus Width x8/x16 Voltage 2.7V-3.6V Package TSOP
Pin Count 56-pin Clock Rate Industry Speed Cycle Time (min)
Operating Temp -40C to +85C

Sim Models & Software

Sim Model (2)
Software (2)
Title & Description Updated Type
M29W G/GS (256Mb) General Low-Level Driver (zip) General low-level driver for M29W G/GS parallel NOR. Download the technical note for this driver here.
(Parallel NOR)
08/2009 Software Add Email
M29W (128Mb, 256Mb, 512Mb) General Low-Level Driver (zip) General low-level driver for 128Mb, 256Mb, and 512Mb M29W parallel NOR.
(Parallel NOR)
02/2014 Software Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (20)
Title & Description Updated Type
Technical Note: LPDDR2 Dual Die Package to Single Die Package Migration (pdf) This technical note provides information to enable migration of a Micron 1Gb LPDDR2 product from a dual-die package to a single-die package.
(TN-42-02)
12/2014 Technical Note Add Email
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Partial Array Self Refresh (PASR) (pdf) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.
(E0597E10)
02/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Deep Power Down (DPD) (pdf) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.
(E0598E21)
02/2014 Technical Note Add Email
Technical Note: Recommended Soldering Conditions & Storage Conditions (pdf) This document shows referential examples of recommended soldering and storage conditions for DRAM products provided by Elpida Memory, Inc.
(E0591E22)
02/2014 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
DRAM Design Analysis Kits (html) The platform-independent storage module PISMO™ specifications address these issues by providing a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email

Parts with the same Data Sheet (26)

M29W256GL70N6E ( Current ) M29W256GH70N6E M29W256GH70N6F M29W256GH70ZA6E M29W256GH70ZA6F M29W256GH70ZS6E M29W256GH70ZS6F M29W256GH7AZA6E M29W256GH7AZS6E M29W256GH7AZS6F M29W256GL7AN6E M29W256GL7AN6F M29W256GL7AZA6E M29W256GL7AZS6E M29W256GL7AZS6F M29W256GH70N3E M29W256GSH70ZS6E M29W256GL70ZS6F M29W256GL70ZS6E M29W256GL70ZA6F M29W256GL70ZA6E M29W256GL70N6F M29W256GH7AN6F M29W256GH7AN6E M29W256GSH70ZS6F M29W256GSL70ZS6F M29W256GSL70ZS6E
Part Status Code Production Production End of Life Production End of Life Production Production Obsolete Production Production Production Production Obsolete Production Production Production End of Life End of Life Production End of Life End of Life End of Life Production Production End of Life End of Life End of Life
Product Name Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell Axcell
Component Density 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb 256Mb
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Depth
Bus Width x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16 x8/x16
Voltage 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V 2.7V-3.6V
Package TSOP TSOP TSOP TBGA TBGA FBGA FBGA TBGA FBGA FBGA TSOP TSOP TBGA FBGA FBGA TSOP FBGA FBGA FBGA TBGA TBGA TSOP TSOP TSOP FBGA FBGA FBGA
Pin Count 56-pin 56-pin 56-pin 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 64-ball 56-pin 56-pin 64-ball 64-ball 64-ball 56-pin 64-ball 64-ball 64-ball 64-ball 64-ball 56-pin 56-pin 56-pin 64-ball 64-ball 64-ball
Clock Rate
Industry Speed
Cycle Time (min)
Operating Temp -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +125C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
M29W256GL70N6E Production Dry Pack N/A N/A N/A Yes 05/04/2011 N/A
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