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Specs

Production  
Production orders are being taken, parts are shipping.
Density 16Mb Part Status Production
Width x8/x16 Voltage 2.7V-3.6V
Package TSOP Pin Count 48-pin
Speed 70ns RoHS Yes
Op Temp -40C to +85C Applications Automotive
Part Family M29W Configuration Top Boot
Media Tray Product Grouping

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Recently Added

Date What was added
09/2012 M29W_Verilog, 160ET/EB, v1.2
07/2012 M29W_IBIS, 160ET/EB_N6, 110nm (T9HX), TSOP48, 2.7-3.6V, v1.1

Sim Models & Software

Title & Description Secure ID Updated
M29W_Verilog, 160ET/EB, v1.2 09/2012
M29W_IBIS, 160ET/EB_N6, 110nm (T9HX), TSOP48, 2.7-3.6V, v1.1 07/2012
See all Sim Models (2)

Documentation & Support

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For M29W160ET7AN6E (6)
Title & Description Secure ID# Updated Type
RoHS Certificate of Compliance: (PDF 244 KB) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 06/2013 RoHS Certification
China RoHS Certificate: (PDF 244 KB) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 06/2013 RoHS Certification
16Mb 3V Parallel NOR Flash: M29W160EB, M29W160ET: (PDF 807.99 KB)16Mb (2Mb x8 or 1Mb x16), 3V, Boot Block, Parallel NOR Flash Memory 04/2011 Data Sheet
Patching the Linux Kernel and U-Boot for Micron® M29 Flash Memory: (PDF 551.89 KB)This technical note provides a guide for modifying the memory technology device (MTD) layer software for the purpose of correctly using Micron® M29 family Flash memory devices in a Linux environment. This document also describes the modifications required to make a Linux environment work with M29 Flash memory devices. TN-13-07 04/2011 Technical Note
Verilog Behavioral Model for Parallel NOR Flash: M29W160WB/T: (PDF 94.7 KB)Verilog Behavioral Model User Guide (UG409020) for M29W160EB/T Parallel NOR Flash Memory 02/2011 Other Documents
Verilog Behavioral Model for M29W160EB/T Flash Memory: (PDF 94.7 KB)This document describes the Verilog behavioral model for M29W160EB and M29W160ET Flash memory devices. UG-409020 11/2010 Technical Note
For Parallel NOR Flash (25)
Title & Description Secure ID# Updated Type
Networking Solutions Guide: (PDF 240.27 KB)This guide outlines Micron’s various solutions—from DRAM components and modules to NOR and NAND Flash to solid state drives (SSDs)—available for networking applications. 06/2013 Other Documents
How to Power On and Power Off M58BW16F/32F and M58BW016F Flash Memory Devices: (PDF 149.38 KB)Provides guidelines for providing power to and removing power from the Micron M58BW16F/32F and M58BW016F parallel NOR Flash memory devices. TN-13-25 04/2013 Technical Note
NOR | NAND Flash Guide: Selecting a Flash Storage Solution : (PDF 215.1 KB)This guide describes the various Flash technologies offered by Micron to help system designers select the optimal Flash solution for their needs. 03/2013 Product Flyer
How to Power On and Power Off the M29F Flash Memory Device: (PDF 151.05 KB)This technical note provides guidelines for providing power to and removing power from the Micron M29F parallel NOR Flash memory device. TN-13-23 03/2013 Technical Note
Migrating from Spansion Am29F to Micron M29F NOR Flash Memories: (PDF 190.83 KB)This technical note explains the process for migrating an application based on Spansion Am29F200B, Am29F400B, Am29F800B, and Am29F160D Flash devices to an application based on Micron M29F Flash devices. TN-1322 03/2013 Technical Note
Micron Compatibility Guide for Xilinx FPGAs: (PDF 119.3 KB)See which Micron memory comes validated on Xilinx platforms. 02/2013 Product Flyer
Micron Parallel NOR Competitor Cross-Reference Guide: (PDF 202.5 KB)Need to compare Micron’s parallel NOR products to other NOR devices out on the market? Our handy Parallel NOR Competitor Cross-Reference Guide provides the specifications you need to map competitors’ devices to the corresponding Micron parts. 02/2013 Product Flyer
G18 Parallel NOR Flash Flyer: (PDF 214.96 KB)Our G18 parallel NOR Flash line of purpose-built MLC embedded memory solutions offers high burst read speeds, fast write speeds, and a wide density range, coupled with low power consumption, flexible architecture, and OTP. 11/2012 Product Flyer
Flash Data Integrator (FDI) 7.14 User Guide: (PDF 1.02 MB)This document describes how to use the high-level structure, features, functional interfaces, and system requirements of the latest release of the FDI software for Flash memory-based file systems. 11/2012 Technical Note
Asynchronous Page Mode Read in M29W320DT/B 32Mb, 3V Supply NOR Flash Memory (Automotive Grade) Devices: (PDF 116.72 KB)This technical note describes the asynchronous page mode read feature available in the M29W320DT/B 32Mb, 3V supply NOR flash memory (automotive grade) devices TN-13-20 09/2012 Technical Note
Parallel NOR Flash Flyer: (PDF 521.44 KB)Today's applications demand an unprecedented combination of features—high performance, high density, high reliability, and low power consumption. Strike a balance between design requirements and cost with our reliable, high-performance parallel NOR. 02/2012 Product Flyer
Flash Data Integrator (FDI) File System Flyer: (PDF 673.02 KB)Running on Micron's latest NOR Flash and phase change memory (PCM), our Flash Data Integrator (FDI) file system provides dependable storage to create a compelling, low-cost solution. In addition, FDI delivers a true eXecute-in-Place (XiP) advantage in an open architecture to manage code and data in NOR and PCM memory devices. 09/2011 Product Flyer
Enabling a Flash Memory Device into the Linux MTD: (PDF 528.81 KB)The technical note introduces the Linux memory technology device (MTD) architecture and provides a basis for understanding how to enable new devices and new features into the Linux MTD. TN-00-25 05/2011 Technical Note
P33/P30 256M, 256M/256M Stack Specification Update: (PDF 90.69 KB) 05/2011 Other Documents
StrataFlash Parallel NOR Flash Errata: P30: (PDF 86.41 KB)StrataFlash Parallel NOR Flash Memory, Errata 02/2011 Other Documents
Designing for Successful Flash Memory Read and Verify Operations: (PDF 79.54 KB)This document provides hardware and software techniques to eliminate read and verify problems caused by VCC and GND transient voltage spikes. AN-679 12/2010 Technical Note
Enhanced Flash Driver (EFD) 2.2 User Guide: (PDF 791.82 KB)This document describes the API and structures associated with the Enhanced Flash Driver 2.2. 11/2010 Technical Note
Micron Flash Data Integrator (FDI): Enabling the Second-Source Low-Level Driver: (PDF 670.15 KB)The Micron Flash Data Integrator (FDI) low-level driver is the interface between the FDI software and the hardware Flash memory component. This document provides details for porting a second-source device into the FDI low-level driver. TN-13-08 11/2010 Technical Note
Reduce Manufacturing Costs with Numonyx Flash Memory Enhanced Factory Programming: (PDF 77.04 KB)This application note explores EFP benefits, limitations, technical concepts and shares empirical data comparing EFP on various programming systems. AN-738 11/2010 Technical Note
Micron Flash Data Integrator (FDI) Support for Java Applications: (PDF 1.52 MB)An instructional reference to customers of Micron's Flash Data Integrator (FDI). An OEM or ODM utilizing FDI in their design would use this application note to construct a comprehensive Java-enabled cellular/embedded system. TN-13-09 11/2010 Technical Note
Improving Programming Throughput of Automated Flash Memories: (PDF 534.29 KB)Provides concepts that can be employed to accelerate programming of write-automated flash memories in manual/automated device programmers, ATE, JTAG/HSS implementations, and in-system write applications. AN-678 11/2010 Technical Note
How to operate Power Loss Recovery for the Numonyx 65nm Flash Memory Devices: (PDF 61.37 KB)This application note describes guidelines on the operations a system designer must perform to recover the flash memory if power loss occurs during a modify operation on the main array of a Numonyx 65nm flash memory device. AN-309046 11/2010 Technical Note
Simplify Manufacturing by Using Automatic-Test-Equipment for On-Board Programming: (PDF 440.67 KB)This document describes using automatic-test-equipment (ATE) to program Numonyx NOR Flash memory components on a PCB. AN-629 11/2010 Technical Note
Designing for On-Board Programming Using the IEEE 1149.1 (JTAG) Access Port: (PDF 81.75 KB)This document provides information on an alternative on-board programming method for small form factor PCB applications using the Joint Test Action Group Test Access Port (JTAG TAP) to perform OBP. AN-630 11/2010 Technical Note
Numonyx Flash Memory Programming Algorithm Optimizations: (PDF 38.1 KB)This application note suggests methods to help you optimize your programming algorithms for quicker Numonyx Flash Memory programming times. AN-759 10/2010 Technical Note
For NOR Flash (10)
Title & Description Secure ID# Updated Type
Industrial and Multi-Market Applications Flyer: (PDF 442.84 KB)Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multimarket segments. 02/2013 Product Flyer
Compatibility Guide for Micron Software Device Drivers Available on micron.com: (PDF 240.38 KB)This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com. 01/2013 Product Flyer
Recommended Soldering Parameters: (PDF 173.37 KB)Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 12/2012 Technical Note
Bypass Capacitor Selection for High-Speed Designs: (PDF 481.9 KB)Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 Technical Note
Micron Wire-Bonding Techniques: (PDF 66.13 KB)This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 Technical Note
Introduction to On-Board Programming with Numonyx Flash Memory: (PDF 87.42 KB)This application note describes the strengths, limitations, programming methods, and design considerations for on-board programming of NOR Flash memory devices. AN-624 11/2010 Technical Note
Uprating of Semiconductors for High-Temperature Applications: (PDF 428.33 KB)Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 Technical Note
Accelerate Design Cycles with Simulation Models: (PDF 206.91 KB)Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 Technical Note
Understanding Signal Integrity: (PDF 1.52 MB)Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 Technical Note
Software Spotlight: Tool
For Products and Support (14)
Title & Description Secure ID# Updated Type
Product Marks/Product and Packaging Labels: (PDF 1.15 MB)Explains product part marking, and product and packaging labels. CSN-11 05/2013 Customer Service Note
Shipping Quantities: (PDF 1.31 MB)Provides tables of part quantity. CSN-04 05/2013 Customer Service Note
Thermal Applications: (PDF 253.94 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 04/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.29 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 10/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 82.64 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 119.08 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

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For M29W160ET7AN6E (3)
Title & Description Secure ID# Updated Type
M29W_Verilog, 160ET/EB, v1.2: (GZ 109.72 KB) 09/2012 Sim Model
M29W_IBIS, 160ET/EB_N6, 110nm (T9HX), TSOP48, 2.7-3.6V, v1.1: (ZIP 64.8 KB) 07/2012 Sim Model
M29W E (16Mb) Device Driver: (ZIP 21.88 KB) Parallel NOR 07/2009 NOR Flash Software
For Parallel NOR Flash (35)
Title & Description Secure ID# Updated Type
m58wr032kb7azb6.zip - IBIS Model, M58WR032KB7AZB6, 32Mb, T=85C, VFBGA56 - 7.7 x 9 mm : (ZIP 66.56 KB) 04/2013 Sim Model
m58bw32f_lbga80.ibs - IBIS Model, M58BW32F, 32Mb, T=125C, LBGA 80-ball : (IBS 528.64 KB) 04/2013 Sim Model
M29W400D_I3.zip - IBIS Model, M29W400D, 4Mb, T=85C, TFBGA48(ZE) 6x8mm : (ZIP 79.84 KB) 04/2013 Sim Model
M29W_VHDL, 640F, 110nm, v1.0: (ZIP 176.15 KB) 04/2013 Sim Model
M29W_IBIS, 640FT/FB_N6, 110nm (T9HX), TSOP48, 2.7-3.6V, v1.0: (ZIP 87.32 KB) 04/2013 Sim Model
Software Driver, M29W640F/ M29W064F (64Mb): (ZIP 26.77 KB) 04/2013 NOR Flash Software
M29DW (256Mb) Device Driver: (ZIP 30.08 KB)Download the technical note for this driver here. Parallel NOR 01/2013 NOR Flash Software
M58W (64Mb) Device Driver: (ZIP 20.81 KB)Download the technical note for this driver here. Parallel NOR 12/2012 NOR Flash Software
J3F (32Mb, 64Mb, 256Mb) Device Driver: (ZIP 16.76 KB)Download the technical note for this driver here. Parallel NOR 12/2012 NOR Flash Software
G18 & M18 (128Mb–1GB) Device Driver: (ZIP 20.36 KB)Download the technical note for this driver here. Parallel NOR 04/2012 NOR Flash Software
M28W EC/FC (32Mb, 64Mb) Device Driver: (ZIP 20.29 KB)Download the technical note for this driver here. Parallel NOR 05/2011 NOR Flash Software
M29EW (128Mb - 2Gb) Device Driver: (ZIP 28.74 KB)Download the technical note for this driver here. Parallel NOR 07/2010 NOR Flash Software
M29AW (512Mb) Device Driver: (ZIP 28.47 KB)Download the technical note for this driver here. Parallel NOR 05/2010 NOR Flash Software
M29W_IBIS, 640FT/FB_ZA6, 110nm (T9HX), TFBGA48, 2.7-3.6V, v1.0: (ZIP 88.5 KB) 05/2010 Sim Model
M29F (2Mb - 16Mb) Device Driver: (ZIP 228.02 KB)Download the technical note for this driver here. Parallel NOR 10/2009 NOR Flash Software
M29W G/GS (256Mb) Device Driver: (ZIP 31.64 KB)Download the technical note for this driver here. Parallel NOR 08/2009 NOR Flash Software
M29W G (128Mb) Device Driver: (ZIP 31.44 KB) Parallel NOR 01/2008 NOR Flash Software
M29W G (64Mb) Device Driver: (ZIP 26.77 KB) Parallel NOR 07/2006 NOR Flash Software
M29W G (64Mb) Device Driver: (ZIP 28.13 KB) Parallel NOR 07/2006 NOR Flash Software
M29W E (32Mb) Device Driver: (ZIP 25.3 KB) Parallel NOR 06/2006 NOR Flash Software
M29W F (128Mb) Device Driver: (ZIP 28.86 KB) Parallel NOR 05/2006 NOR Flash Software
M29DW F_2 (64Mb) Device Driver: (ZIP 25.39 KB) Parallel NOR 05/2006 NOR Flash Software
M29DW F_1 (64Mb) Device Driver: (ZIP 35.32 KB) Parallel NOR 05/2006 NOR Flash Software
M29DW F (128Mb) Device Driver: (ZIP 32.98 KB) Parallel NOR 05/2006 NOR Flash Software
M29W F (64Mb) Device Driver: (ZIP 26.77 KB) Parallel NOR 05/2006 NOR Flash Software
M28W E/EC (16Mb) Device Driver: (ZIP 18.58 KB) Parallel NOR 01/2006 NOR Flash Software
W18 & W30 (16Mb - 64Mb) Device Driver: (ZIP 22.04 KB) Parallel NOR 04/2005 NOR Flash Software
L18 (128Mb, 256Mb) & L30 (64Mb, 128Mb) Device Driver: (ZIP 22.89 KB) Parallel NOR 04/2005 NOR Flash Software
K3 (64Mb, 128Mb) Device Driver: (ZIP 22.12 KB) Parallel NOR 04/2005 NOR Flash Software
C3 (8Mb - 32Mb) Device Driver: (ZIP 32.34 KB) Parallel NOR 04/2005 NOR Flash Software
M58BW BB/BDB (32Mb) Device Driver: (ZIP 5.9 KB) Parallel NOR 01/2005 NOR Flash Software
M29W D (4Mb) Device Driver: (ZIP 20.47 KB) Parallel NOR 07/2003 NOR Flash Software
M29W D (8Mb) Device Driver: (ZIP 21 KB) Parallel NOR 05/2003 NOR Flash Software
M29DW D (32Mb) Device Driver: (ZIP 26.09 KB) Parallel NOR 03/2003 NOR Flash Software
M29W D (32Mb) Device Driver: (ZIP 22.98 KB)Download the technical note for this driver here. Parallel NOR 10/2001 NOR Flash Software
For NOR Flash (7)
Title & Description Secure ID# Updated Type
M25PX (64Mb) Device Driver: (ZIP 15.4 KB) SPI NOR 01/2013 NOR Flash Software
N25Q (16Mb-1Gb) Device Driver: (ZIP 17.46 KB)Download the technical note for this driver here. SPI NOR 11/2012 NOR Flash Software
Serialize Function for the SPI Controller: (ZIP 5.55 KB)Provides the serialize function for the serial peripheral interface (SPI) controller for Micron’s serial Flash devices (NAND, NOR, and PCM). SPI NOR 12/2011 NOR Flash Software
M25PX (32Mb) Device Driver: (ZIP 19.74 KB) SPI NOR 11/2007 NOR Flash Software
M25PE (1Mb - 8Mb) Device Driver: (ZIP 17.48 KB) SPI NOR 10/2005 NOR Flash Software
M25P (512Kb - 64Mb) Device Driver: (ZIP 18.68 KB) SPI NOR 07/2005 NOR Flash Software
M45PE (1Mb - 8Mb) Device Driver: (ZIP 16.78 KB) SPI NOR 11/2004 NOR Flash Software
For Products and Support (0)
Title & Description Secure ID# Updated Type

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  1. Micron Models: By downloading any Micron model from this site, you must agree to the terms of Micron's Simulation Models License Agreement. If you do not agree to terms, you do not have permission to use the site or download material from it.
  2. Non-Micron Models: For your convenience, Micron links to third-party simulation models. Note that Micron does not guarantee functionality or accuracy of these models.

NOR Flash FAQs (5)

Does thermal information change for IT parts?
Thermal information includes temperature limits and thermal impedance values. Temperature limits do change for IT parts (TC, TJ, and TA), but thermal impedance values (θJA, θJB, and θJC) do not because thermal impedance depends primarily on the package.
My design was based on a specification stating the JTAG was relative to VDD (1.8V), but now we’ve discovered that JTAG is actually relative to VDDQ (1.5V). It’s a fairly significant board spin to change this; what do I risk by leaving the design as-is? I assume that the specification is still for VDDQ + 0.3V = 1.8V, but with CMOS parts there’s no way I can guarantee that it won’t swing past that on transitions.
Your particular board design should not be a cause of major concern. The pins can handle the VDD voltage regardless of the VDDQ voltage.
Should the ECC memory chip share chip select and CKE signals with the other two main memory chips in our point-to-point application?
The ECC chip(s) should share the same CKE and CS# as the other devices because they are accessed as the same piece of data.
What is a "bank"?
A bank is an array of memory bits. Multiple arrays or banks are contained within a DRAM component. Depending on density, DRAM components may consist of 4 or 8 banks. For example, a bank may consist of 32 million rows, 4 bits across. This would equate to 128 megabits. Four of these banks in a single DRAM component would yield a 512Mb component.
What is the impedance tolerance of the driver in match-impedance mode relative to the expected value base on the perfect reference resistor connected to ZQ pin?
The impedance tolerance of the driver is ±15 percent.

Products and Support FAQs (1)

Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact buymicron.com.