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Software Device Drivers for MT29F Micron NAND Flash Memory: (PDF 339.4 KB)This technical note explains how to use Micron’s MT29F NAND Flash memory software device drivers, which are the low-level drivers (LLDs) that manage the hardware functionality of the NAND Flash memory devices. Download the low-level driver described in this document here.
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TN-29-72
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05/2013
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Technical Note |
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NOR | NAND Flash Guide: Selecting a Flash Storage Solution : (PDF 215.1 KB)This guide describes the various Flash technologies offered by Micron to help system designers select the optimal Flash solution for their needs.
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03/2013
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Product Flyer |
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Compatibility Guide for Micron Software Device Drivers Available on micron.com: (PDF 240.38 KB)This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com.
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01/2013
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Product Flyer |
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Recommended Soldering Parameters: (PDF 173.37 KB)Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
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TN-00-15
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12/2012
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Technical Note |
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Next Generation Flash + Controller Part Numbering System: (PDF 24.1 KB)
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11/2012
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Part Numbering Guide |
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ONFI Member Flyer: (PDF 1.02 MB)
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08/2012
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Product Flyer |
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Flash + Controller Part Numbering System: (PDF 28.46 KB)
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08/2012
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Part Numbering Guide |
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High-Performance NAND Flyer: (PDF 272.79 KB)Fast, Reliable, Robust – Diverse Performance Options for Demanding Applications
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07/2012
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Product Flyer |
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Enabling Software BCH Error Correction Code (ECC) on a Linux Platform: (PDF 688.7 KB)This technical note addresses applications using existing 1-bit ECC processors to enable Micron MT29F1GxxABxDA, MT29F2GxxABxEA, MT29F4GxxABxDA, and MT29F1GXXABXEA NAND Flash memory devices with software BCH ECC.
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TN-29-71
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04/2012
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Technical Note |
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Optimize your system designs using Flash memory: (PDF 6.18 MB)
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04/2012
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Presentation |
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ONFI 2.3a Gold: (PDF 2.7 MB)
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10/2011
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Other Documents |
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NAND 201: An Update on the Continued Evolution of NAND Flash: (PDF 641.28 KB)Chronicles the developments in NAND technology from 2006 through early 2011.
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09/2011
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White Paper |
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Physical NAND Flash Security: (PDF 2.32 MB)
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08/2011
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Presentation |
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Looking Ahead at Flash Memory: (PDF 6.43 MB)
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08/2011
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Presentation |
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400 MT/s NAND Interface Solutions: (PDF 2 MB)Why are 400 MT/s speeds necessary? Presentation from Flash Memory Summit 2011.
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08/2011
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Presentation |
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System Benefits of EZ-NAND/Enhanced ClearNAND Flash: (PDF 1.77 MB)
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08/2011
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Presentation |
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NAND Flash Comparisons for Mobile: (PDF 4.84 MB)
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08/2011
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Presentation |
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FMS2011 Keynote: (PDF 2.41 MB)
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08/2011
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Presentation |
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Current and Emerging Memory Technology Landscape: (PDF 2.78 MB)
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08/2011
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Presentation |
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Enabling a Flash Memory Device into the Linux MTD: (PDF 528.81 KB)The technical note introduces the Linux memory technology device (MTD) architecture and provides a basis for understanding how to enable new devices and new features into the Linux MTD.
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TN-00-25
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05/2011
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Technical Note |
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TN-29-51: Migrating from 50-Series to 60-Series SLC NAND Flash Devices: (PDF 121.59 KB)Migrating from 50-Series to 60-Series SLC NAND Flash Devices; M58A, M59A, M50A, M68A, M69A, M60A
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TN-29-51
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05/2011
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Technical Note |
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TN-29-57: Migrating from 50-Series to 60-Series SPI NAND Flash Devices: (PDF 164.87 KB)Supplements the product change notification (PCN) covering the transition from Micron 50-series (50nm) to 60-series (34nm) single-level cell (SLC) SPI NAND Flash devices.
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TN-29-57
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05/2011
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Technical Note |
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Bypass Capacitor Selection for High-Speed Designs: (PDF 481.9 KB)Describes bypass capacitor selection for high-speed designs.
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TN-00-06
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03/2011
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Technical Note |
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ONFI 3.0 Spec: (PDF 4.3 MB)
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03/2011
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Other Documents |
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TN-29-56: Enabling On-Die ECC for OMAP3 on Linux/Android OS: (PDF 331.14 KB)Enabling NAND On-Die ECC for OMAP3 Using Linux/Android OS with YAFFS2. M60A, M69A, M68A.
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TN-29-56
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12/2010
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Technical Note |
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Micron Wire-Bonding Techniques: (PDF 66.13 KB)This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
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TN-00-22
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11/2010
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Technical Note |
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Wear Leveling in NAND Flash Memory: (PDF 213.59 KB)This technical note describes the recommended wear leveling algorithm to be implemented in the FTL software for NAND Flash memory.
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TN-29-61
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10/2010
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Technical Note |
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Software Device Drivers for Very Large Page Micron NAND Flash Memory: (PDF 405.64 KB)This technical note explains how to use the Micron very large page NAND Flash memory software device drivers. Download the low-level driver described in this document here.
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TN-29-65
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10/2010
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Technical Note |
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Software Device Drivers for Small Page Micron NAND Flash Memory: (PDF 889.73 KB)This technical note explains how to use the Micron small page NAND Flash memory software drivers. Download the low-level driver described in this document here.
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TN-29-64
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10/2010
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Technical Note |
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Migrating from a Chip Enable Care to a Don't Care NAND Flash Memory: (PDF 265.78 KB)The purpose of this application note is to highlight the differences between Chip Enable don’t care and Chip Enable care devices.
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AN2365
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10/2010
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Technical Note |
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Garbage Collection in SLC NAND Flash Memory: (PDF 207.37 KB)This technical note describes the recommended garbage collection algorithm to be implemented in the Flash Translation Layer (FTL) software for single-level cell (SLC) NAND Flash memory devices.
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AN1821
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10/2010
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Technical Note |
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Error Correction Code in SLC NAND Flash: (PDF 486.67 KB)This technical note describes how to implement error correction code (ECC) in Micron small page and large page single-level cell (SLC) NAND Flash memory that can detect 2-bit errors and correct 1-bit errors per 256 or 512 bytes.
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TN-29-63
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10/2010
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Technical Note |
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Bad Block Management in NAND Flash Memory: (PDF 317.81 KB)This technical note explains how to recognize factory-generated bad blocks and manage bad blocks that develop during the lifetime of NAND Flash memory.
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TN-29-59
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10/2010
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Technical Note |
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TN-29-52: Migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC NAND Flash Memory to 34nm: (PDF 180.46 KB)Provides guidelines for migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC, large-page NAND Flash memory to 34nm technology (M60A, M69A & M68A)
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TN-29-52
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10/2010
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Technical Note |
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NAND Flash Flyer: (PDF 145.74 KB)Describes why Micron NAND is the best fit for your applications
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08/2010
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Product Flyer |
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NAND Choices Flyer: (PDF 141.94 KB)A quick look at choosing the right NAND solution for your design needs
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08/2010
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Product Flyer |
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Uprating of Semiconductors for High-Temperature Applications: (PDF 428.33 KB)Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
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TN-00-18
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05/2010
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Technical Note |
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NAND Flash 101 - An Introduction to NAND Flash and How to Design It In to Your Next Product: (PDF 968.5 KB)Provides an introduction to NAND Flash and how to design it into your next product. Rev. B
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TN-29-19
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04/2010
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Technical Note |
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NAND Flash Performance Improvement Using Internal Data Move: (PDF 219.17 KB)NAND data management capabilities and higher system performance through NAND Flash internal data moves
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TN-29-15
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03/2010
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Technical Note |
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On-Die ECC NAND Flash Flyer: (PDF 173.52 KB)With four times or more th density of NOR, On-Die EC NAND is a great alternative to NOR for many embedded designs.
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03/2010
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Product Flyer |
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NAND Flash Performance Increase with PROGRAM PAGE CACHE MODE Command: (PDF 266.14 KB)This technical note discusses the benefits of PROGRAM PAGE CACHE MODE operations over normal PROGRAM PAGE operations. It also provides specific timing examples and instructions for performing PROGRAM PAGE CACHE MODE operations. Rev. C
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TN-29-14
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02/2010
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Technical Note |
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Accelerate Design Cycles with Simulation Models: (PDF 206.91 KB)Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
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02/2010
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Technical Note |
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Determining NAND Flash Ready/Busy Status: (PDF 136.48 KB)Systems that utilize NAND Flash memory can use either the ready/busy pin or the status register to determine whether a Micron® NAND Flash device is busy or ready to accept a new command. This technical note addresses the use of status register bit 5, which indicates the ready/busy status of the NAND Flash device.
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TN-29-13
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02/2010
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Technical Note |
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The Many Flavors of NAND...and More to Come: (PDF 8.03 MB)Keynote for Flash Memory Summit 2009
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12/2009
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Presentation |
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The Inconvenient Truths of NAND Flash Memory: (PDF 344.36 KB)Overview of NAND Flash
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12/2009
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Presentation |
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Power Requirements for Multi-Bit Per Cell NAND Flash: (PDF 90.65 KB)Technology differences, power consumption considerations
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12/2009
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Presentation |
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Overcoming (or Embracing) the Dreaded Single-Source Dilemma: (PDF 241.11 KB)Multisourcing versus single-sourcing
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12/2009
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Presentation |
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Optimizing NAND Flash Performance: (PDF 149.28 KB)Improving NAND performance in various applications
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12/2009
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Presentation |
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ONFI Standards and What They Mean to Designers: (PDF 166.18 KB)Inconsistencies without ONFI and results with ONFI
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12/2009
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Presentation |
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NAND Flash Reliability and Performance - The Software Effect: (PDF 296.15 KB)NAND software
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12/2009
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Presentation |
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NAND Flash Consideratons for Consumer Applications: (PDF 700.54 KB)NAND requirements/system reliability in consumer applications
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12/2009
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Presentation |
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NAND Flash Architecture and Specification Trends: (PDF 696.58 KB)How to prepare for changes brought on by technology shrinks
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12/2009
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Presentation |
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Improving Power Budgeting Estimates in NAND Applications: (PDF 694.29 KB)Measuring Icc with better predictability
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12/2009
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Presentation |
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An ONFI Update: (PDF 1007.42 KB)Overview of enhancements and the path to higher performance
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12/2009
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Presentation |
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A Closer Look at NAND Flash: (PDF 2.7 MB)Exploring the possibilities of SSDs
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12/2009
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Presentation |
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3-Bit/Cell NAND Flash: (PDF 90.87 KB)Architecture, performance, endurance, system requirements, cost advantages, applications
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12/2009
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Presentation |
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Flash Memory Technology Direction: (PDF 643.16 KB)This paper explains the trade-offs associated with available disk caching methods, the differences between various types of Flash memory, and the advantages that NAND offers when superior performance is critically important.
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12/2009
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White Paper |
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Understanding Signal Integrity: (PDF 1.52 MB)Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
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TN-00-20
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12/2009
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Technical Note |
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Memory Management in NAND Flash Arrays: (PDF 271.42 KB)Describes common NAND Flash memory-management methods for effective use of the NAND Flash memory array
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TN-29-28
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12/2009
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Technical Note |
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IBIS Behavioral Models: (PDF 163.98 KB)Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
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TN-00-07
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11/2009
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Technical Note |
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Understanding Quality and Reliability Requirements for Bare Die Applications: (PDF 142.04 KB)Describes the quality and reliability requirements for bare die applications
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TN-00-14
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10/2009
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Technical Note |
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Thinning Considerations for Wafer Products: (PDF 73.58 KB)Information on optimal wafer-thinning processes to meet specific customer requirements
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TN-00-19
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10/2009
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Technical Note |
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Next-Generation NAND Flash Part Numbering System: (PDF 35.73 KB)Part numbering guide for Micron Next-Generation NAND Flash products.
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08/2009
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Part Numbering Guide |
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ONFI Flyer: (PDF 162.55 KB)
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06/2009
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Product Flyer |
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Standard NAND Flash Part Numbering System: (PDF 28.52 KB)Part numbering guide for Micron Standard NAND Flash products.
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02/2009
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Part Numbering Guide |
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SEMI Wafer Map Format: (PDF 110 KB)Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
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TN-00-21
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02/2009
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Technical Note |
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TN-29-37: Comparing 40 and 50-Series SLC NAND Flash Devices: (PDF 728.87 KB)Prior to conversion, Micron recommends that the target design take into account the product data sheet and the specific changes highlighted in this technical note. This Technical note covers the M58A, M59A & M50A products.
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TN-29-37
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01/2009
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Technical Note |
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Wear-Leveling Techniques in NAND Flash Devices: (PDF 268.3 KB)Highlights the importance of wear leveling, explains two wear-leveling techniques, and discusses implementing wear leveling
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TN-29-42
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10/2008
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Technical Note |
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Using COPYBACK Operations to Maintain Data Integrity in NAND Flash Devices: (PDF 101.39 KB)Describes how to use COPYBACK operations in NAND Flash devices
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TN-29-41
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10/2008
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Technical Note |
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Improving NAND Flash Performance Using Two-Plane Command Enabled Micron Devices: (PDF 123.28 KB)Describes the performance benefits of Micron two-plane commands, and provides implementation guidelines for making the best use of two-plane capabilities
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TN-29-25
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09/2008
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Technical Note |
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Booting from Embedded MMC: (PDF 282.02 KB)Describes booting from an embedded ARM processor in the MMC environment
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TN-29-18
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06/2008
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Technical Note |
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Which NAND solution is best for my design?: (PDF 158.84 KB)Micron offers a full line of high-performance memory solutions—from SLC and MLC to Serial NAND, to e•MMC™ and MCPs—for a variety of applications. And we work with chipset vendors, OS designers, and other enablers to ensure that they’re optimized for your design.
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11/2007
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Webinar |
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NAND Flash Status Register Response in Cache Programming Operations: (PDF 253.71 KB)Describes status register responses when operating in cache programming modes
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TN-29-26
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06/2007
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Technical Note |
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Boot-from-NAND Using Micron MT28F1G08ABA NAND Flash with the Texas Instruments OMAP 2420 Processor: (PDF 435.55 KB)Describes Boot-from-NAND using Micron MT29F1G08ABA NAND Flash with the Texas Instruments OMAP 2420 processor.
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TN-29-16
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06/2007
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Technical Note |
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NAND Flash Controller on Spartan-3: (PDF 872.4 KB)This technical note describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor and use of the Micron glueless interface to interface a processor with NAND Flash memory.
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TN-29-06
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06/2007
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Technical Note |
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Micron® NAND Flash Controller via Xilinx® Spartan™-3 FPGA: (PDF 872.4 KB)Describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor, and use of the Micron glueless interface to interface a processor with NAND Flash memory.
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TN-29-06
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06/2007
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Technical Note |
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Small Block vs. Large Block NAND Devices: (PDF 387.87 KB)Large-block NAND Flash devices offer significant performance increases over their small-block NAND Flash counterparts for READ, PROGRAM, and ERASE operations.
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TN-29-07
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05/2007
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Technical Note |
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NAND Flash Security: (PDF 189.32 KB)Using Micron NAND Flash security features to implement component and code authentication security solutions, designers can protect critical system components and proprietary system software from unwanted attacks and alterations.
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TN-29-11
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05/2007
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Technical Note |
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NAND Flash Performance Increase : (PDF 205.94 KB)Customers using the PAGE READ CACHE MODE operation provided in Micron NAND Flash devices will realize significant performance gains in systems requiring increased data volume at a much faster rate.
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TN-29-01
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05/2007
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Technical Note |
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Monitoring Ready/Busy Status in 2, 4, and 8Gb Micron NAND Flash Devices: (PDF 96.08 KB)Four options for determining the NAND Flash ready/busy device status are presented with detailed explanations of each option.
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TN-29-13
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05/2007
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Technical Note |
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Hamming Codes for NAND Flash Memories: (PDF 229.46 KB)Outlines hamming codes NAND Flash memory
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TN-29-08
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05/2007
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Technical Note |
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ECC Module for Xilinx Spartan-3FPGA: (PDF 997.75 KB)Micron's ECC module was developed and tested using Xilinx(R) Spartan-3 and can be ported to certain other platforms of the user's choosing.
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TN-29-05
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05/2007
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Technical Note |
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FBGA Date Codes: (PDF 22.36 KB)Date codes for FBGA-packaged components
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08/2005
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Part Numbering Guide |
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Software Spotlight:
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Tool |