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MT29F64G08CBABAWP

Data Sheets (1)

Data Sheet
Data Sheet Updated 12/2013

Specs

Orderable Parts for: MT29F64G08CBABAWP
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F64G08CBABAWP:B Production N/A N/A N/A N/A No N/A
Detailed Specifications
Density 64Gb Status Production RoHS Yes Width x8
Voltage 3.3V Package TSOP Pin Count 48-pin MT/s
I/O Common Product Name

Sim Models & Software

Sim Model (3)
Title & Description Updated Type
IBIS: NAND 64Gb/128/256/512Gb MLC Async/Sync, L84A (zip) Rev 2.0
(L84A)
09/2012 Sim Model Add Email
HSpice: NAND 64Gb/128/256/512Gb MLC Async/Sync, L84A (zip)
(L84A)
09/2012 Sim Model Add Email
Verilog: NAND 64/128/256/512Gb MLC L84A (zip) 64/128/256/512Gb Verilog model Rev 7.30
(L84A)
01/2014 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (50)
Title & Description Updated Type
NAND Flash Controller on Spartan-3 (pdf) This technical note describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor and use of the Micron glueless interface to interface a processor with NAND Flash memory.
(TN-29-06)
07/2014 Technical Note Add Email
Technical Note: Using Chip Enable Pin Reduction in NAND Flash Memory Devices (pdf) This technical note describes how to enable and use the chip enable pin reduction feature in Micron's NAND Flash memory devices and discusses reduction limitations based on NAND package and system configuration.
(TN-29-77)
05/2014 Technical Note Add Email
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Technical note: Using the Block Lock Feature on MT29F NAND Flash Memory Devices (pdf) This technical note describes the block lock feature on Micron's MT29F NAND Flash memory devices.
(TN-2976)
02/2014 Technical Note Add Email
Enabling On-Die ECC NAND with JFFS2 (pdf) This technical note addresses altering the the MTD/NAND layer for the on-die ECC NAND device.
(TN-29-75)
08/2013 Technical Note Add Email
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Customer Service Note (5)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (6)
Title & Description Updated Type
PISMO2 Boards (html) The platform-independent storage module PISMO™ specifications provides a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
SLC, MLC, TLC – What’s the Difference? In this 4-minute, whiteboard video, Director of NAND Strategic Marketing, Kevin Kilbuck, provides a brief description of the technical differences among SLC, MLC, and TLC. 01/0001 Tool Add Email
Choosing the Right NAND Flash memory manufacturers are offering a variety of NAND Flash memory products—including some specialized NAND solutions—with significantly different performance capabilities and features across a number of process nodes. This NAND diversification means that designers cannot simply select any NAND Flash device for their applications, but rather need to have a basic understanding of the features and benefits of each type of NAND in order to select both the proper device and the proper supplier. 01/0001 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email
ONFI Advantages The Open NAND Flash Interface (ONFI) is a collaboration among Micron and many other NAND Flash suppliers, controller manufacturers, and designers. The primary goal of the ONFI working group is to develop open standards for the interface used to communicate with NAND Flash memory—standards that will increase compatibility and interoperability among conforming NAND devices from different vendors. This, in turn, will increase the supply base for standard devices, reduce design time, and speed time to market. 01/0001 Tool Add Email
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Parts with the same Data Sheet (20)

MT29F64G08CBABAWP ( Current ) MT29F64G08CBABAL84A3WC1 MT29F128G08CFABAWP MT29F64G08CBABBWP MT29F256G08CJABAWP MT29F256G08CJABBWP-12 MT29F128G08CECBBH1-10 MT29F256G08CMCBBH2-10 MT29F256G08CKCBBH2-10 MT29F64G08CBCBBH1-10 MT29F128G08CECBBH1-10IT MT29F256G08CMCBBH2-10IT MT29F64G08CBABBL84A3WC1 MT29F64G08CBEBBL84A3WC1 MT29F128G08CFABAWP-IT MT29F128G08CFABBWP-12 MT29F128G08CFABBWP-12IT MT29F256G08CJABAWP-IT MT29F256G08CJABBWP-12IT MT29F64G08CBABAWP-IT MT29F64G08CBABBWP-12IT
Status Production Production Production Production Production Production Production Production Production Production Production Production Obsolete Production Production Production Production Production Production Production Production
Density 64Gb 64Gb 128Gb 64Gb 256Gb 256Gb 128Gb 256Gb 256Gb 64Gb 128Gb 256Gb 64Gb 64Gb 128Gb 128Gb 128Gb 256Gb 256Gb 64Gb 64Gb
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Width x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Package TSOP Wafer TSOP TSOP TSOP TSOP VBGA TBGA TBGA VBGA VBGA TBGA Wafer Wafer TSOP TSOP TSOP TSOP TSOP TSOP TSOP
Pin Count 48-pin n/a 48-pin 48-pin 48-pin 48-pin 100-ball 100-ball 100-ball 100-ball 100-ball 100-ball n/a n/a 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin 48-pin
MT/s n/a 166 MT/s 200 MT/s 166 MT/s 166 MT/s 166 MT/s 200 MT/s 200 MT/s n/a 166 MT/s 166 MT/s 166 MT/s 166 MT/s
I/O Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common
Product Name

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F64G08CBABAWP:B Production N/A N/A N/A N/A No N/A
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