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MT29F2G16ABBEAH4

Data Sheets (1)

Data Sheet
Data Sheet Updated 04/2014

Specs

Orderable Parts for: MT29F2G16ABBEAH4
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2G16ABBEAH4:E Production N/A NW265 N/A N/A No N/A
Detailed Specifications
Density 2Gb Status Production RoHS Yes Width x16
Voltage 1.8V Package VFBGA Pin Count 63-ball MT/s
I/O Common

Sim Models & Software

Sim Model (3)
Title & Description Updated Type
Verilog: NAND 2Gb SLC M69A (zip) 2Gb Verilog model Rev 7.30
(M69A)
08/2012 Sim Model Add Email
HSpice: NAND 2Gb SLC (Rev E) M69A (zip) Rev. 2.1
(M69A)
10/2014 Sim Model Add Email
IBIS: NAND 2Gb SLC (Rev E) M69A (zip) Rev. 2.2
(M69A)
10/2014 Sim Model Add Email
Software (4)
Title & Description Updated Type
Small Page SLC NAND (128Mb, 256Mb, 512Mb, 1Gb) General Low-Level Driver (zip) General low-level driver for legacy Numonyx small page SLC NAND. Download the technical note for this driver here. 11/2009 Software Add Email
1-Bit Software ECC (zip) NAND Flash software driver ECC 12/2009 Software Add Email
Very Large Page SLC NAND (8Gb) General Low-Level Driver (zip) General low-level driver for legacy Numonyx very large page SLC NAND. Download the technical note for this driver here. 03/2010 Software Add Email
Large Page SLC NAND (1Gb, 4Gb) General Low-Level Driver (zip) General low-level driver for legacy Numonyx large page SLC NAND. Download the technical note for this driver here. 07/2011 Software Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (52)
Title & Description Updated Type
NAND Flash Controller on Spartan-3 (pdf) This technical note describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor and use of the Micron glueless interface to interface a processor with NAND Flash memory.
(TN-29-06)
07/2014 Technical Note Add Email
Technical Note: Using Chip Enable Pin Reduction in NAND Flash Memory Devices (pdf) This technical note describes how to enable and use the chip enable pin reduction feature in Micron's NAND Flash memory devices and discusses reduction limitations based on NAND package and system configuration.
(TN-29-77)
05/2014 Technical Note Add Email
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Technical note: Using the Block Lock Feature on MT29F NAND Flash Memory Devices (pdf) This technical note describes the block lock feature on Micron's MT29F NAND Flash memory devices.
(TN-2976)
02/2014 Technical Note Add Email
Enabling On-Die ECC NAND with JFFS2 (pdf) This technical note addresses altering the the MTD/NAND layer for the on-die ECC NAND device.
(TN-29-75)
08/2013 Technical Note Add Email
See All Results
Customer Service Note (4)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email

Tool (6)
Title & Description Updated Type
PISMO2 Boards (html) The platform-independent storage module PISMO™ specifications provides a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
SLC, MLC, TLC – What’s the Difference? In this 4-minute, whiteboard video, Director of NAND Strategic Marketing, Kevin Kilbuck, provides a brief description of the technical differences among SLC, MLC, and TLC. 01/0001 Tool Add Email
Choosing the Right NAND Flash memory manufacturers are offering a variety of NAND Flash memory products—including some specialized NAND solutions—with significantly different performance capabilities and features across a number of process nodes. This NAND diversification means that designers cannot simply select any NAND Flash device for their applications, but rather need to have a basic understanding of the features and benefits of each type of NAND in order to select both the proper device and the proper supplier. 01/0001 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email
ONFI Advantages The Open NAND Flash Interface (ONFI) is a collaboration among Micron and many other NAND Flash suppliers, controller manufacturers, and designers. The primary goal of the ONFI working group is to develop open standards for the interface used to communicate with NAND Flash memory—standards that will increase compatibility and interoperability among conforming NAND devices from different vendors. This, in turn, will increase the supply base for standard devices, reduce design time, and speed time to market. 01/0001 Tool Add Email
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Parts with the same Data Sheet (20)

MT29F2G16ABBEAH4 ( Current ) MT29F2G08ABAEAH4 MT29F2G08ABAEAH4-IT MT29F2G08ABAEAM69A3WC1 MT29F2G08ABAEAWP MT29F2G08ABAEAWP-IT MT29F2G08ABBEAH4 MT29F2G08ABBEAH4-IT MT29F2G08ABBEAHC MT29F2G08ABBEAHC-IT MT29F2G08ABBEAM69A3WC1 MT29F2G16ABAEAM69A3WC1 MT29F2G16ABAEAWP MT29F2G16ABAEAWP-IT MT29F2G16ABBEAH4-IT MT29F2G16ABBEAHC MT29F2G16ABBEAHC-IT MT29F2G16ABBEAM69A3WC1 MT29F2G08ABAEAWP-ITX MT29F2G08ABAEAH4-ITX MT29F2G08ABBEAH4-ITX
Status Production Production Production Production Production Production Production Production Production Production Contact Factory Production Production Production Production Production Production Production Production Production Production
Density 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Width x16 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x16 x16 x16 x16 x16 x16 x16 x8 x8 x8
Voltage 1.8V 3.3V 3.3V 3.3V 3.3V 3.3V 1.8V 1.8V 1.8V 1.8V 1.8V 3.3V 3.3V 3.3V 1.8V 1.8V 1.8V 1.8V 3.3V 3.3V 1.8V
Package VFBGA VFBGA VFBGA Wafer TSOP TSOP VFBGA VFBGA VFBGA VFBGA Wafer Wafer TSOP TSOP VFBGA VFBGA VFBGA Wafer TSOP VFBGA VFBGA
Pin Count 63-ball 63-ball 63-ball n/a 48-pin 48-pin 63-ball 63-ball 63-ball 63-ball n/a n/a 48-pin 48-pin 63-ball 63-ball 63-ball n/a 48-pin 63-ball 63-ball
MT/s
I/O Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common Common

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT29F2G16ABBEAH4:E Production N/A NW265 N/A N/A No N/A
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