2Gb Mass Storage: MT29F2G16ABBEAH4

wafers

Specifications

  • Density: 2Gb
  • Status: Production
  • RoHS: Yes
  • Width: x16
  • Voltage: 1.8V
  • Package: VFBGA
  • Pin Count: 63-ball
  • Bits/Cell: SLC
  • MT/s:
  • I/O: Common
  • Op Temp: 0C to +70C

Data Sheets

MT29F2G16ABBEAH4:E

Production orders are being taken, parts are shipping.

Orderable Part Part Status Buy Online
MT29F2G16ABBEAH4:E Production Contact Rep

Please Note: Distributor inventory is an estimate and may not reflect actual available memory. Some links on this page will take you from the Micron web site. Micron does not control the content on these web sites.

Type Secure Title & Description ID# Updated Size
NAND Flash Performance Increase :  Customers using the PAGE READ CACHE MODE operation provided in Micron NAND Flash devices will realize significant performance gains in systems requiring increased data volume at a much faster rate. TN-29-01 05/2007 205.94 KB
Small Block vs. Large Block NAND Devices:  Large-block NAND Flash devices offer significant performance increases over their small-block NAND Flash counterparts for READ, PROGRAM, and ERASE operations. TN-29-07 05/2007 387.87 KB
NAND Flash Security:  Using Micron NAND Flash security features to implement component and code authentication security solutions, designers can protect critical system components and proprietary system software from unwanted attacks and alterations. TN-29-11 05/2007 189.32 KB
Monitoring Ready/Busy Status in 2, 4, and 8Gb Micron NAND Flash Devices:  Four options for determining the NAND Flash ready/busy device status are presented with detailed explanations of each option. TN-29-13 05/2007 96.08 KB
NAND Flash Performance Increase with PROGRAM PAGE CACHE MODE Command:  This technical note discusses the benefits of PROGRAM PAGE CACHE MODE operations over normal PROGRAM PAGE operations. It also provides specific timing examples and instructions for performing PROGRAM PAGE CACHE MODE operations. Rev. C TN-29-14 02/2010 266.14 KB
Boot-from-NAND Using Micron MT28F1G08ABA NAND Flash with the Texas Instruments OMAP 2420 Processor:  Describes Boot-from-NAND using Micron MT29F1G08ABA NAND Flash with the Texas Instruments OMAP 2420 processor. TN-29-16 06/2007 435.55 KB
Booting from Embedded MMC:  Describes booting from an embedded ARM processor in the MMC environment TN-29-18 06/2008 282.02 KB
NAND Flash 101 - An Introduction to NAND Flash and How to Design It In to Your Next Product:  Provides an introduction to NAND Flash and how to design it into your next product. Rev. B TN-29-19 04/2010 968.5 KB
Improving NAND Flash Performance Using Two-Plane Command Enabled Micron Devices:  Describes the performance benefits of Micron two-plane commands, and provides implementation guidelines for making the best use of two-plane capabilities TN-29-25 09/2008 123.28 KB
NAND Flash Status Register Response in Cache Programming Operations:  Describes status register responses when operating in cache programming modes TN-29-26 06/2007 253.71 KB
Memory Management in NAND Flash Arrays:  Describes common NAND Flash memory-management methods for effective use of the NAND Flash memory array TN-29-28 12/2009 271.42 KB
Using COPYBACK Operations to Maintain Data Integrity in NAND Flash Devices:  Describes how to use COPYBACK operations in NAND Flash devices TN-29-41 10/2008 101.39 KB
Wear-Leveling Techniques in NAND Flash Devices:  Highlights the importance of wear leveling, explains two wear-leveling techniques, and discusses implementing wear leveling TN-29-42 10/2008 268.3 KB
NAND Flash Performance Improvement Using Internal Data Move:  NAND data management capabilities and higher system performance through NAND Flash internal data moves TN-29-15 03/2010 219.17 KB
IBIS Behavioral Models:  Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site. TN-00-07 11/2009 163.98 KB
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Understanding Quality and Reliability Requirements for Bare Die Applications:  Describes the quality and reliability requirements for bare die applications TN-00-14 10/2009 152.83 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
SEMI Wafer Map Format:  Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files. TN-00-21 02/2009 110 KB
Thinning Considerations for Wafer Products:  Information on optimal wafer-thinning processes to meet specific customer requirements TN-00-19 10/2009 73.58 KB
Micron® ECC Module for NAND Flash via Xilinx® Spartanâ„¢-3 FPGA:  Micron® ECC module was developed and tested using Xilinx® Spartanâ„¢-3 and can be ported to certain other platforms of the user’s choosing. TN-29-05 05/2007 997.75 KB
Micron® NAND Flash Controller via Xilinx® Spartanâ„¢-3 FPGA:  Describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor, and use of the Micron glueless interface to interface a processor with NAND Flash memory. TN-29-06 06/2007 872.4 KB
TN-29-37: Comparing 40 and 50-Series SLC NAND Flash Devices:  Prior to conversion, Micron recommends that the target design take into account the product data sheet and the specific changes highlighted in this technical note. This Technical note covers the M58A, M59A & M50A products. TN-29-37 01/2009 728.87 KB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
NAND Flash Controller on Spartan-3:  This technical note describes the Micron NAND Flash controller, techniques for interfacing the NAND Flash device with a processor and use of the Micron glueless interface to interface a processor with NAND Flash memory. TN-29-06 06/2007 872.4 KB
ECC Module for Xilinx Spartan-3:  Describes the Micron® ECC module that was developed and tested using Xilinx® Spartanâ„¢-3 and can be ported to certain other platforms of the user’s choosing. TN-29-05 05/2007 997.75 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Determining NAND Flash Ready/Busy Status:  Systems that utilize NAND Flash memory can use either the ready/busy pin or the status register to determine whether a Micron® NAND Flash device is busy or ready to accept a new command. This technical note addresses the use of status register bit 5, which indicates the ready/busy status of the NAND Flash device. TN-29-13 02/2010 136.48 KB
TN-29-51: Migrating from 50-Series to 60-Series SLC NAND Flash Devices:  Migrating from 50-Series to 60-Series SLC NAND Flash Devices; M58A, M59A, M50A, M68A, M69A, M60A TN-29-51 05/2011 121.59 KB
TN-29-52: Migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC NAND Flash Memory to 34nm:  Provides guidelines for migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC, large-page NAND Flash memory to 34nm technology (M60A, M69A & M68A) TN-29-52 10/2010 180.46 KB
TN-29-17: NAND Flash Design and Use Considerations:  Describes design and use considerations for NAND Flash memory, focusing on bad-block identification and error correction. TN-29-17 09/2010 226.04 KB
Migrating from a Chip Enable Care to a Don't Care NAND Flash Memory:  The purpose of this application note is to highlight the differences between Chip Enable don’t care and Chip Enable care devices. AN2365 10/2010 265.78 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB
Enabling a Flash Memory Device into the Linux MTD:  The technical note introduces the Linux memory technology device (MTD) architecture and provides a basis for understanding how to enable new devices and new features into the Linux MTD. TN-00-25 05/2011 528.81 KB
Hamming Codes for NAND Flash Memories:  Outlines hamming codes NAND Flash memory TN-29-08 05/2007 229.46 KB
TN-29-56: Enabling On-Die ECC for OMAP3 on Linux/Android OS:  Enabling NAND On-Die ECC for OMAP3 Using Linux/Android OS with YAFFS2. M60A, M69A, M68A. TN-29-56 12/2010 331.14 KB
TN-29-57: Migrating from 50-Series to 60-Series SPI NAND:  Supplements the product change notification (PCN) covering the transition from Micron® 50-series (50nm) to 60-series (34nm) single-level cell (SLC) SPI NAND Flash devices. TN-29-57 05/2011 164.87 KB
TN-29-58: ONFI NV-DDR2 Design Guide:  Rev. A TN-29-58 03/2011 685.04 KB
Bad Block Management in NAND Flash Memory:  This technical note explains how to recognize factory-generated bad blocks and manage bad blocks that develop during the lifetime of NAND Flash memory. TN-29-59 10/2010 317.81 KB
Garbage Collection in SLC NAND Flash Memory:  This technical note describes the recommended garbage collection algorithm to be implemented in the Flash Translation Layer (FTL) software for single-level cell (SLC) NAND Flash memory devices. AN1821 10/2010 207.37 KB
Wear Leveling in NAND Flash Memory:  This technical note describes the recommended wear leveling algorithm to be implemented in the FTL software for NAND Flash memory. TN-29-61 10/2010 213.59 KB
Software Device Drivers for Large Page Micron NAND Flash Memory Devices:  This technical note explains how to use the Micron large page NAND Flash memory software device drivers. TN-29-62 10/2011 624.45 KB
Error Correction Code in SLC NAND Flash:  This technical note describes how to implement error correction code (ECC) in Micron small page and large page single-level cell (SLC) NAND Flash memory that can detect 2-bit errors and correct 1-bit errors per 256 or 512 bytes. TN-29-63 10/2010 486.67 KB
Software Device Drivers for Small Page Micron NAND Flash Memory:  This technical note explains how to use the Micron small page NAND Flash memory software drivers. TN-29-64 10/2010 889.73 KB
Software Device Drivers for Very Large Page Micron NAND Flash Memory:  This technical note explains how to use the Micron very large page NAND Flash memory software device drivers. TN-29-65 10/2010 405.64 KB
TN-2968 Addendum Boot Block Protection for M70M, M71M, M79M NAND:  04/2012 107.88 KB
Enabling Software BCH Error Correction Code (ECC) on a Linux Platform:  This technical note addresses applications using existing 1-bit ECC processors to enable Micron MT29F1GxxABxDA, MT29F2GxxABxEA, MT29F4GxxABxDA, and MT29F1GXXABXEA NAND Flash memory devices with software BCH ECC. TN-29-71 04/2012 688.7 KB

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

Type Secure Title & Description ID# Updated Size
Next-Generation NAND Flash Part Numbering System:  Part numbering guide for Micron Next-Generation NAND Flash products. 08/2009 35.73 KB
Small Page SLC (128Mb - 1Gb):  NAND Flash Software driver 11/2009 9.59 KB
Standard NAND Flash Part Numbering System:  Part numbering guide for Micron Standard NAND Flash products. 02/2009 28.52 KB
Flash Memory Technology Direction:  This paper explains the trade-offs associated with available disk caching methods, the differences between various types of Flash memory, and the advantages that NAND offers when superior performance is critically important. White Paper 12/2009 643.16 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 79.21 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 04/2012 472.27 KB
Micron KGD Definitions:  Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 65.52 KB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 887.13 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Endurance Requirements for Next-Generation SLC NAND on Mobile Systems:  Program/erase cycling effects in mobile systems 12/2009 141.19 KB
ONFI Standards and What They Mean to Designers:  Inconsistencies without ONFI and results with ONFI 12/2009 166.18 KB
Optimizing NAND Flash Performance:  Improving NAND performance in various applications 12/2009 149.28 KB
A Closer Look at NAND Flash:  Exploring the possibilities of SSDs 12/2009 2.7 MB
The Inconvenient Truths of NAND Flash Memory:  Overview of NAND Flash 12/2009 344.36 KB
Overcoming (or Embracing) the Dreaded Single-Source Dilemma:  Multisourcing versus single-sourcing 12/2009 241.11 KB
NAND Flash Reliability and Performance - The Software Effect:  NAND software 12/2009 296.15 KB
Introduction to Flash Memory:  Basics of Flash memory 12/2009 1.11 MB
Power Requirements for Multi-Bit Per Cell NAND Flash:  Technology differences, power consumption considerations 12/2009 90.65 KB
3-Bit/Cell NAND Flash:  Architecture, performance, endurance, system requirements, cost advantages, applications 12/2009 90.87 KB
NAND Flash Consideratons for Consumer Applications:  NAND requirements/system reliability in consumer applications 12/2009 700.54 KB
Improving Power Budgeting Estimates in NAND Applications:  Measuring Icc with better predictability 12/2009 694.29 KB
The Many Flavors of NAND...and More to Come:  Keynote for Flash Memory Summit 2009 12/2009 8.03 MB
NAND Flash Architecture and Specification Trends:  How to prepare for changes brought on by technology shrinks 12/2009 696.58 KB
An ONFI Update:  Overview of enhancements and the path to higher performance 12/2009 1007.42 KB
Choosing the Right NAND for Your Application:  Market overview, traditional versus newer devices, and Micron's broad product offering 12/2009 2.72 MB
NAND Flash – The Basics and Beyond:  MP3s, USB drives, removable storage cards, cell phones—and an endless number of other applications where mobility, power consumption, speed, and size are factors—are moving to NAND Flash. Get the basics on NAND Flash operations and commands, along with information about ECC, processors, and software, and find out how well they fit with your design needs. 11/2007 158.84 KB
ONFI 2.0: High Speed NAND Overview:  Discusses the limitations of the NAND interface and how ONFI 2.0 helps overcome performance limitations and provide greater scalability. Presented by Applications Engineering Manager and ONFI Technical Team Member, Michael Abraham. 11/2007 158.84 KB
FBGA Date Codes:  Date codes for FBGA-packaged components 08/2005 22.36 KB
1-Bit Software ECC:  NAND Flash software driver ECC 12/2009 3.26 KB
Flash + Controller Part Numbering System:  03/2012 27.98 KB
How ClearNAND Flash Simplifies and Enhances System Designs:  Discusses NAND Flash trends and complexities; NAND interface choices; and how Micron's Enhanced ClearNAND Flash helps eliminate the impact of NAND's ever-increasing ECC requirements. White Paper 07/2011 814.8 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
System Benefits of EZ-NAND/Enhanced ClearNAND Flash:  08/2011 1.77 MB
FMS2011 Keynote:  08/2011 2.41 MB
Current and Emerging Memory Technology Landscape:  08/2011 2.78 MB
NAND Flash Comparisons for Mobile:  08/2011 4.84 MB
Looking Ahead at Flash Memory:  08/2011 6.43 MB
400 MT/s NAND Interface Solutions:  08/2011 2 MB
Physical NAND Flash Security:  08/2011 2.32 MB
NAND 201: An Update on the Continued Evolution of NAND Flash:  Chronicles the developments in NAND technology from 2006 through early 2011. White Paper 09/2011 641.28 KB
NAND Binary BCH Code Software:  02/2010 132.93 KB
Large Page SLC (1Gb, 4Gb):  NAND Flash Software driver 01/2010 17.27 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 04/2012 724.89 KB
Optimize your system designs using Flash memory:  04/2012 6.18 MB
Industrial and Multi-Market Applications Flyer:  Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multi-market segments. Product Flyer 08/2011 593.95 KB
2Gb: x8, x16 ECC NAND M69A:  2Gb ECC NAND Data Sheet, Rev. N M69A 02/2012 1.25 MB
Compatibility Guide for Micron Software Device Drivers Available on micron.com:  This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com. Product Flyer 02/2012 227.69 KB
NAND Choices Flyer:  A quick look at choosing the right NAND solution for your design needs 08/2010 141.94 KB
NAND Flash Flyer:  Describes why Micron NAND is the best fit for your applications 08/2010 145.74 KB
NAND Flash Low Level Drivers for x16 Devices:  01/2010 15.34 KB
Very Large Page SLC (8Gb):  NAND Flash Software driver 03/2010 10.23 KB
On-Die ECC NAND Flash Flyer:  With four times or more th density of NOR, On-Die EC NAND is a great alternative to NOR for many embedded designs. 03/2010 173.52 KB
ONFI Flyer:  06/2009 162.55 KB
BeagleBoard SPI NAND MTD for Linux 2.6.33:  SPI NAND GPL drivers for 50 series NAND. 06/2011 9.65 KB

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Type Secure Title & Description ID# Updated Size
IBIS: NAND 2Gb SLC (Rev E) M69A:  Rev. 2.1 M69A 04/2011 1.62 MB
Verilog: 2Gb x8 x16 ECC NAND (REV E) M69A:  Verilog_rev_7_22 M69A 08/2009 63.94 KB

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  2. Non-Micron Models: For your convenience, Micron links to third-party simulation models. Note that Micron does not guarantee functionality or accuracy of these models.
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