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MT8JSF25664HZ-1G1

Data Sheets (1)

Data Sheet
Data Sheet Updated 04/2013

Specs

Orderable Parts for: MT8JSF25664HZ-1G1
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT8JSF25664HZ-1G1D1 Obsolete N/A N/A View N/A No View

Compare

Compare MT8KTF25664HZ-1G6
(Recommended Part)
MT8JSF25664HZ-1G1D1
Part Status Code Obsolete Production Obsolete
Component Density 2Gb 2Gb
RoHS Green Green Green
Depth 256Mb 256Mb 256Mb
Bus Width x64 x64 x64
Voltage 1.5V 1.35V 1.5V
Package SODIMM SODIMM SODIMM
Pin Count 204-pin 204-pin 204-pin
Clock Rate
Cycle Time (min)
Operating Temp 0C to +95C 0C to +95C 0C to +95C
CAS Latency CL = 7 CL = 11 CL = 7
Industry Speed PC3-8500 PC3-12800 PC3-8500
Detailed Specifications
Component Density 2Gb Part Status Code Obsolete RoHS Green Depth 256Mb
Bus Width x64 Voltage 1.5V Package SODIMM Pin Count 204-pin
Clock Rate Cycle Time (min) Operating Temp 0C to +95C CAS Latency CL = 7
Industry Speed PC3-8500

Sim Models & Software

Sim Model (4)
Title & Description Updated Type
IBIS (zip) H1 01/2011 Sim Model Add Email
IBIS (zip) D1 01/2011 Sim Model Add Email
IBIS (zip) H1 01/2011 Sim Model Add Email
Hyperlynx (zip) D1 08/2013 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (21)
Title & Description Updated Type
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
User's Manual: New Features of DDR3 SDRAM (pdf) This manual is intended for users who design application systems using DDR3 SDRAM manufactured by Elpida.
(E1503E10)
02/2014 Technical Note Add Email
Technical Note: Recommended Soldering Conditions & Storage Conditions (pdf) This document shows referential examples of recommended soldering and storage conditions for DRAM products provided by Elpida Memory, Inc.
(E0591E22)
02/2014 Technical Note Add Email
Technical Note: DDR3 8Gb DDP 2CS to 8Gb SDP 1CS Transition Guide (pdf) This technical note explains how to transition a dual-rank 8Gb 2CS (dual die) MT41K512M16 DDP device to a single-rank 8Gb 1CS (monolithic) MT41K512M16 SDP device.
(TN-41-16)
02/2014 Technical Note Add Email
DDR3 Point-to-Point Design Support (pdf) DDR3 is an evolutionary transition from DDR2.
(TN-41-13)
08/2013 Technical Note Add Email
See All Results
Customer Service Note (4)
Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (1)
Title & Description Updated Type
DRAM Design Analysis Kits (html) The platform-independent storage module PISMO™ specifications address these issues by providing a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email

Parts with the same Data Sheet (1)

MT8JSF25664HZ-1G1 ( Current ) MT8JSF25664HZ-1G4
Part Status Code Obsolete Contact Factory
Component Density 2Gb 2Gb
RoHS Green Green
Depth 256Mb 256Mb
Bus Width x64 x64
Voltage 1.5V 1.5V
Package SODIMM SODIMM
Pin Count 204-pin 204-pin
Clock Rate
Cycle Time (min)
Operating Temp 0C to +95C 0C to +95C
CAS Latency CL = 7 CL = 9
Industry Speed PC3-8500 PC3-10600

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT8JSF25664HZ-1G1D1 Obsolete N/A N/A View N/A No View

Compare

Compare MT8KTF25664HZ-1G6
(Recommended Part)
MT8JSF25664HZ-1G1D1
Part Status Code Obsolete Production Obsolete
Component Density 2Gb 2Gb
RoHS Green Green Green
Depth 256Mb 256Mb 256Mb
Bus Width x64 x64 x64
Voltage 1.5V 1.35V 1.5V
Package SODIMM SODIMM SODIMM
Pin Count 204-pin 204-pin 204-pin
Clock Rate
Cycle Time (min)
Operating Temp 0C to +95C 0C to +95C 0C to +95C
CAS Latency CL = 7 CL = 11 CL = 7
Industry Speed PC3-8500 PC3-12800 PC3-8500
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