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MT18JDF51272PDZ-1G4

Data Sheets (1)

Data Sheet
Data Sheet Updated 04/2013

Specs

Orderable Parts for: MT18JDF51272PDZ-1G4
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT18JDF51272PDZ-1G4D1 EOL N/A N/A View N/A No View

Compare

Compare MT18KDF51272PDZ-1G6
(Recommended Part)
MT18JDF51272PDZ-1G4D1
Part Status End of Life Production End of Life
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 4GB 4GB 4GB
RoHS Green Green Green
Comp. Count 18 18 18
Depth 512Mb 512Mb 512Mb
Width x72 x72 x72
Pin Count 240-pin 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C 0C to +95C
Data Rate 1333 MT/s 1600 MT/s 1333 MT/s
Speed PC3-10600 PC3-12800 PC3-10600
CL CL = 9 CL = 11 CL = 9
Voltage 1.5V 1.35V 1.5V
Component Config 256 Meg x 8 512 Meg x 4 256 Meg x 8
ECC ECC ECC ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register Parity Parity Parity
Detailed Specifications
Technology DDR3 SDRAM Density 4GB Part Status End of Life RoHS Green
Comp. Count 18 Depth 512Mb Width x72 Pin Count 240-pin
Op Temp 0C to +95C Data Rate 1333 MT/s Speed PC3-10600 CL CL = 9
Voltage 1.5V Component Config 256 Meg x 8 ECC ECC Module Rank Dual Rank
Register Parity

Sim Models & Software

Sim Model (3)
Title & Description Updated Type
IBIS (zip) D1 07/2010 Sim Model Add Email
IBIS (zip) M1 02/2012 Sim Model Add Email
IBIS (zip) K1 03/2014 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (11)
Title & Description Updated Type
Moisture Absorption in Plastic Packages (pdf) Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
(TN-00-01)
02/2013 Technical Note Add Email
Recommended Soldering Parameters (pdf) Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
(TN-00-15)
12/2012 Technical Note Add Email
Bypass Capacitor Selection for High-Speed Designs (pdf) Describes bypass capacitor selection for high-speed designs.
(TN-00-06)
03/2011 Technical Note Add Email
Micron Wire-Bonding Techniques (pdf) This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
(TN-00-22)
11/2010 Technical Note Add Email
Uprating of Semiconductors for High-Temperature Applications (pdf) Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
(TN-00-18)
05/2010 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
Proper Handling Procedures for Modules and SSDs (pdf) Includes procedures for how to properly handle modules and SSDs.
(CSN-23)
05/2013 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
Micron Validated Memory The Module Search Tool can be used in conjunction with the sections below to find information on Micron validated DDR3 SDRAM modules. 01/0001 Tool Add Email
Serial Presence Detect Micron’s SPD data conforms to JEDEC industry standards and is available through Micron’s SPD tool with your Micron module part number. 01/0001 Tool Add Email

Parts with the same Data Sheet (3)

MT18JDF51272PDZ-1G4 ( Current ) MT18JDF51272PDZ-1G1 MT18JDF51272PDZ-1G6 MT18JDF51272PDZ-1G9
Part Status End of Life Obsolete Production Production
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 4GB 4GB 4GB 4GB
RoHS Green Green Green Green
Comp. Count 18 18 18 18
Depth 512Mb 512Mb 512Mb 512Mb
Width x72 x72 x72 x72
Pin Count 240-pin 240-pin 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C 0C to +95C 0C to +95C
Data Rate 1333 MT/s 1066 MT/s 1600 MT/s 1866 MT/s
Speed PC3-10600 PC3-8500 PC3-12800 PC3-14900
CL CL = 9 CL = 7 CL = 11 CL = 13
Voltage 1.5V 1.5V 1.5V 1.5V
Component Config 256 Meg x 8 256 Meg x 8 256 Meg x 8 256 Meg x 8
ECC ECC ECC ECC ECC
Module Rank Dual Rank Dual Rank Dual Rank Dual Rank
Register Parity Non Parity Parity Parity

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT18JDF51272PDZ-1G4D1 EOL N/A N/A View N/A No View

Compare

Compare MT18KDF51272PDZ-1G6
(Recommended Part)
MT18JDF51272PDZ-1G4D1
Part Status End of Life Production End of Life
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 4GB 4GB 4GB
RoHS Green Green Green
Comp. Count 18 18 18
Depth 512Mb 512Mb 512Mb
Width x72 x72 x72
Pin Count 240-pin 240-pin 240-pin
Op Temp 0C to +95C 0C to +95C 0C to +95C
Data Rate 1333 MT/s 1600 MT/s 1333 MT/s
Speed PC3-10600 PC3-12800 PC3-10600
CL CL = 9 CL = 11 CL = 9
Voltage 1.5V 1.35V 1.5V
Component Config 256 Meg x 8 512 Meg x 4 256 Meg x 8
ECC ECC ECC ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register Parity Parity Parity
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