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MT16JSF51264HZ-1G1

Data Sheets (1)

Data Sheet
Data Sheet Updated 04/2013

Specs

Orderable Parts for: MT16JSF51264HZ-1G1
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT16JSF51264HZ-1G1D1 Obsolete N/A N/A View N/A No View

Compare

Compare MT16KTF51264HZ-1G6
(Recommended Part)
MT16JSF51264HZ-1G1D1
Part Status Obsolete Production Obsolete
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 4GB 4GB 4GB
RoHS Green Green Green
Comp Count 16 16 16
Depth 512Mb 512Mb 512Mb
Width x64 x64 x64
Pin Count 204-pin 204-pin 204-pin
Op. Temp. 0C to +95C 0C to +95C 0C to +95C
Data Rate 1066 MT/s 1600 MT/s 1066 MT/s
Speed PC3-8500 PC3-12800 PC3-8500
Clock Rate
CL CL = 7 CL = 11 CL = 7
Voltage 1.5V 1.35V 1.5V
Comp Config 256 Meg x 8 256 Meg x 8 256 Meg x 8
ECC Non ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register Non Parity Non Parity Non Parity
Part Type Standard Standard Standard
Detailed Specifications
Technology DDR3 SDRAM Density 4GB Part Status Obsolete RoHS Green
Comp Count 16 Depth 512Mb Width x64 Pin Count 204-pin
Op. Temp. 0C to +95C Data Rate 1066 MT/s Speed PC3-8500 Clock Rate
CL CL = 7 Voltage 1.5V Comp Config 256 Meg x 8 ECC Non ECC
Module Rank Dual Rank Register Non Parity Part Type Standard

Sim Models & Software

Sim Model (3)
Title & Description Updated Type
HyperLynx (zip) D1 08/2010 Sim Model Add Email
IBIS (zip) M1 02/2011 Sim Model Add Email
IBIS (zip) D1 03/2011 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (13)
Title & Description Updated Type
Moisture Absorption in Plastic Packages (pdf) Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
(TN-00-01)
02/2013 Technical Note Add Email
Recommended Soldering Parameters (pdf) Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
(TN-00-15)
12/2012 Technical Note Add Email
Bypass Capacitor Selection for High-Speed Designs (pdf) Describes bypass capacitor selection for high-speed designs.
(TN-00-06)
03/2011 Technical Note Add Email
Micron Wire-Bonding Techniques (pdf) This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
(TN-00-22)
11/2010 Technical Note Add Email
Uprating of Semiconductors for High-Temperature Applications (pdf) Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
(TN-00-18)
05/2010 Technical Note Add Email
See All Results
Customer Service Note (4)
Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
Proper Handling Procedures for Modules and SSDs (pdf) Includes procedures for how to properly handle modules and SSDs.
(CSN-23)
05/2013 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
Micron Validated Memory The Module Search Tool can be used in conjunction with the sections below to find information on Micron validated DDR3 SDRAM modules. 01/0001 Tool Add Email
Serial Presence Detect Micron’s SPD data conforms to JEDEC industry standards and is available through Micron’s SPD tool with your Micron module part number. 01/0001 Tool Add Email

Parts with the same Data Sheet (1)

MT16JSF51264HZ-1G1 ( Current ) MT16JSF51264HZ-1G4
Part Status Obsolete Obsolete
Technology DDR3 SDRAM DDR3 SDRAM
Density 4GB 4GB
RoHS Green Green
Comp Count 16 16
Depth 512Mb 512Mb
Width x64 x64
Pin Count 204-pin 204-pin
Op. Temp. 0C to +95C 0C to +85C
Data Rate 1066 MT/s 1333 MT/s
Speed PC3-8500 PC3-10600
Clock Rate
CL CL = 7 CL = 9
Voltage 1.5V 1.5V
Comp Config 256 Meg x 8 256 Meg x 8
ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank
Register Non Parity Non Parity
Part Type Standard Standard

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT16JSF51264HZ-1G1D1 Obsolete N/A N/A View N/A No View

Compare

Compare MT16KTF51264HZ-1G6
(Recommended Part)
MT16JSF51264HZ-1G1D1
Part Status Obsolete Production Obsolete
Technology DDR3 SDRAM DDR3 SDRAM DDR3 SDRAM
Density 4GB 4GB 4GB
RoHS Green Green Green
Comp Count 16 16 16
Depth 512Mb 512Mb 512Mb
Width x64 x64 x64
Pin Count 204-pin 204-pin 204-pin
Op. Temp. 0C to +95C 0C to +95C 0C to +95C
Data Rate 1066 MT/s 1600 MT/s 1066 MT/s
Speed PC3-8500 PC3-12800 PC3-8500
Clock Rate
CL CL = 7 CL = 11 CL = 7
Voltage 1.5V 1.35V 1.5V
Comp Config 256 Meg x 8 256 Meg x 8 256 Meg x 8
ECC Non ECC Non ECC Non ECC
Module Rank Dual Rank Dual Rank Dual Rank
Register Non Parity Non Parity Non Parity
Part Type Standard Standard Standard
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