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MT9HTF3272Y-53E

Data Sheets (1)

Data Sheet
Data Sheet Updated 03/2010

Specs

Orderable Parts for: MT9HTF3272Y-53E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT9HTF3272Y-53EB2 Obsolete N/A N/A View N/A No N/A
Detailed Specifications
Technology DDR2 SDRAM Density 256MB Part Status Obsolete RoHS Yes
Comp. Count 9 Depth 32Mb Width x72 Pin Count 240-pin
Op Temp 0C to +85C Data Rate 533 MT/s Speed PC2-4200 CL CL = 4
Voltage 1.8V Comp. Config 32 Meg x 8 ECC ECC Module Rank Single Rank
Register Non Parity

Sim Models & Software

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (12)
Title & Description Updated Type
Moisture Absorption in Plastic Packages (pdf) Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
(TN-00-01)
02/2013 Technical Note Add Email
Recommended Soldering Parameters (pdf) Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
(TN-00-15)
12/2012 Technical Note Add Email
Bypass Capacitor Selection for High-Speed Designs (pdf) Describes bypass capacitor selection for high-speed designs.
(TN-00-06)
03/2011 Technical Note Add Email
Micron Wire-Bonding Techniques (pdf) This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
(TN-00-22)
11/2010 Technical Note Add Email
Uprating of Semiconductors for High-Temperature Applications (pdf) Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
(TN-00-18)
05/2010 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
Proper Handling Procedures for Modules and SSDs (pdf) Includes procedures for how to properly handle modules and SSDs.
(CSN-23)
05/2013 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
Micron Validated Memory The Module Search Tool can be used in conjunction with the sections below to find information on Micron validated DDR3 SDRAM modules. 01/0001 Tool Add Email
Serial Presence Detect Micron’s SPD data conforms to JEDEC industry standards and is available through Micron’s SPD tool with your Micron module part number. 01/0001 Tool Add Email

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT9HTF3272Y-53EB2 Obsolete N/A N/A View N/A No N/A
Contact Your Sales Rep
Contact A Rep
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