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MT4HTF3264HZ-800

Data Sheets (1)

Data Sheet
Data Sheet Updated 04/2014

Specs

Orderable Parts for: MT4HTF3264HZ-800
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT4HTF3264HZ-800G1 Contact Factory N/A N/A View N/A No View

Compare

Compare MT4HTF3264HZ-800
(Recommended Part)
MT4HTF3264HZ-800G1
Part Status Production Production
Technology DDR2 SDRAM DDR2 SDRAM
Density 256MB 256MB
RoHS Yes Yes
Comp Count 4 4
Depth 32Mb 32Mb
Width x64 x64
Pin Count 200-pin 200-pin
Op. Temp. 0C to +85C 0C to +85C
Data Rate 800 MT/s 800 MT/s
Speed PC2-6400 PC2-6400
Clock Rate
CL CL = 6 CL = 6
Voltage 1.8V 1.8V
Comp Config 32 Meg x 16 32 Meg x 16
ECC Non ECC Non ECC
Module Rank Single Rank Single Rank
Register Non Parity Non Parity
Part Type Standard Standard
MT4HTF3264HZ-800H1 Production N/A N/A View N/A No View

Compare

Compare MT4HTF3264HZ-800
(Recommended Part)
MT4HTF3264HZ-800H1
Part Status Production Production
Technology DDR2 SDRAM DDR2 SDRAM
Density 256MB 256MB
RoHS Yes Yes
Comp Count 4 4
Depth 32Mb 32Mb
Width x64 x64
Pin Count 200-pin 200-pin
Op. Temp. 0C to +85C 0C to +85C
Data Rate 800 MT/s 800 MT/s
Speed PC2-6400 PC2-6400
Clock Rate
CL CL = 6 CL = 6
Voltage 1.8V 1.8V
Comp Config 32 Meg x 16 32 Meg x 16
ECC Non ECC Non ECC
Module Rank Single Rank Single Rank
Register Non Parity Non Parity
Part Type Standard Standard
Detailed Specifications
Technology DDR2 SDRAM Density 256MB Part Status Production RoHS Yes
Comp Count 4 Depth 32Mb Width x64 Pin Count 200-pin
Op. Temp. 0C to +85C Data Rate 800 MT/s Speed PC2-6400 Clock Rate
CL CL = 6 Voltage 1.8V Comp Config 32 Meg x 16 ECC Non ECC
Module Rank Single Rank Register Non Parity Part Type Standard

Sim Models & Software

Sim Model (1)
Title & Description Updated Type
IBIS (zip) G1 11/2012 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (13)
Title & Description Updated Type
Moisture Absorption in Plastic Packages (pdf) Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
(TN-00-01)
02/2013 Technical Note Add Email
Recommended Soldering Parameters (pdf) Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
(TN-00-15)
12/2012 Technical Note Add Email
Bypass Capacitor Selection for High-Speed Designs (pdf) Describes bypass capacitor selection for high-speed designs.
(TN-00-06)
03/2011 Technical Note Add Email
Micron Wire-Bonding Techniques (pdf) This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
(TN-00-22)
11/2010 Technical Note Add Email
Uprating of Semiconductors for High-Temperature Applications (pdf) Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
(TN-00-18)
05/2010 Technical Note Add Email
See All Results
Customer Service Note (4)
Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
Proper Handling Procedures for Modules and SSDs (pdf) Includes procedures for how to properly handle modules and SSDs.
(CSN-23)
05/2013 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
Micron Validated Memory The Module Search Tool can be used in conjunction with the sections below to find information on Micron validated DDR3 SDRAM modules. 01/0001 Tool Add Email
Serial Presence Detect Micron’s SPD data conforms to JEDEC industry standards and is available through Micron’s SPD tool with your Micron module part number. 01/0001 Tool Add Email

Parts with the same Data Sheet (3)

MT4HTF3264HZ-800 ( Current ) MT4HTF3264HZ-667 MT4HTF6464HZ-667 MT4HTF6464HZ-800
Part Status Production Contact Factory Contact Factory Production
Technology DDR2 SDRAM DDR2 SDRAM DDR2 SDRAM DDR2 SDRAM
Density 256MB 256MB 512MB 512MB
RoHS Yes Yes Yes Yes
Comp Count 4 4 4 4
Depth 32Mb 32Mb 64Mb 64Mb
Width x64 x64 x64 x64
Pin Count 200-pin 200-pin 200-pin 200-pin
Op. Temp. 0C to +85C 0C to +85C 0C to +85C 0C to +85C
Data Rate 800 MT/s 667 MT/s 667 MT/s 800 MT/s
Speed PC2-6400 PC2-5300 PC2-5300 PC2-6400
Clock Rate
CL CL = 6 CL = 5 CL = 5 CL = 6
Voltage 1.8V 1.8V 1.8V 1.8V
Comp Config 32 Meg x 16 32 Meg x 16 64 Meg x 16 64 Meg x 16
ECC Non ECC Non ECC Non ECC Non ECC
Module Rank Single Rank Single Rank Single Rank Single Rank
Register Non Parity Non Parity Non Parity Non Parity
Part Type Standard Standard Standard Standard

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT4HTF3264HZ-800G1 Contact Factory N/A N/A View N/A No View

Compare

Compare MT4HTF3264HZ-800
(Recommended Part)
MT4HTF3264HZ-800G1
Part Status Production Production
Technology DDR2 SDRAM DDR2 SDRAM
Density 256MB 256MB
RoHS Yes Yes
Comp Count 4 4
Depth 32Mb 32Mb
Width x64 x64
Pin Count 200-pin 200-pin
Op. Temp. 0C to +85C 0C to +85C
Data Rate 800 MT/s 800 MT/s
Speed PC2-6400 PC2-6400
Clock Rate
CL CL = 6 CL = 6
Voltage 1.8V 1.8V
Comp Config 32 Meg x 16 32 Meg x 16
ECC Non ECC Non ECC
Module Rank Single Rank Single Rank
Register Non Parity Non Parity
Part Type Standard Standard
MT4HTF3264HZ-800H1 Production N/A N/A View N/A No View

Compare

Compare MT4HTF3264HZ-800
(Recommended Part)
MT4HTF3264HZ-800H1
Part Status Production Production
Technology DDR2 SDRAM DDR2 SDRAM
Density 256MB 256MB
RoHS Yes Yes
Comp Count 4 4
Depth 32Mb 32Mb
Width x64 x64
Pin Count 200-pin 200-pin
Op. Temp. 0C to +85C 0C to +85C
Data Rate 800 MT/s 800 MT/s
Speed PC2-6400 PC2-6400
Clock Rate
CL CL = 6 CL = 6
Voltage 1.8V 1.8V
Comp Config 32 Meg x 16 32 Meg x 16
ECC Non ECC Non ECC
Module Rank Single Rank Single Rank
Register Non Parity Non Parity
Part Type Standard Standard
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