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MT36VDDF25672Y-40B

Data Sheets (1)

Data Sheet
Data Sheet Updated 10/2009

Specs

Orderable Parts for: MT36VDDF25672Y-40B
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT36VDDF25672Y-40BF3 Contact Factory N/A N/A View N/A No View

Compare

Compare MT36VDDF25672Y-40B
(Recommended Part)
MT36VDDF25672Y-40BF3
Part Status Production Production
Technology DDR SDRAM DDR SDRAM
Density 2GB 2GB
RoHS Yes Yes
Comp. Count 36 36
Depth 256Mb 256Mb
Width x72 x72
Pin Count 184-pin 184-pin
Op Temp 0C to +70C 0C to +70C
Data Rate 400 MT/s 400 MT/s
Speed PC3200 PC3200
CL CL = 3 CL = 3
Voltage 2.6V 2.6V
Comp. Config 128 Meg x 4 128 Meg x 4
ECC ECC ECC
Module Rank Dual Rank Dual Rank
Register
MT36VDDF25672Y-40BJ1 Production N/A N/A View N/A No View

Compare

Compare MT36VDDF25672Y-40B
(Recommended Part)
MT36VDDF25672Y-40BJ1
Part Status Production Production
Technology DDR SDRAM DDR SDRAM
Density 2GB 2GB
RoHS Yes Yes
Comp. Count 36 36
Depth 256Mb 256Mb
Width x72 x72
Pin Count 184-pin 184-pin
Op Temp 0C to +70C 0C to +70C
Data Rate 400 MT/s 400 MT/s
Speed PC3200 PC3200
CL CL = 3 CL = 3
Voltage 2.6V 2.6V
Comp. Config 128 Meg x 4 128 Meg x 4
ECC ECC ECC
Module Rank Dual Rank Dual Rank
Register
Detailed Specifications
Technology DDR SDRAM Density 2GB Part Status Production RoHS Yes
Comp. Count 36 Depth 256Mb Width x72 Pin Count 184-pin
Op Temp 0C to +70C Data Rate 400 MT/s Speed PC3200 CL CL = 3
Voltage 2.6V Comp. Config 128 Meg x 4 ECC ECC Module Rank Dual Rank
Register

Sim Models & Software

Sim Model (1)
Title & Description Updated Type
IBIS (zip) F3 06/2010 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (12)
Title & Description Updated Type
Moisture Absorption in Plastic Packages (pdf) Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
(TN-00-01)
02/2013 Technical Note Add Email
Recommended Soldering Parameters (pdf) Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
(TN-00-15)
12/2012 Technical Note Add Email
Bypass Capacitor Selection for High-Speed Designs (pdf) Describes bypass capacitor selection for high-speed designs.
(TN-00-06)
03/2011 Technical Note Add Email
Micron Wire-Bonding Techniques (pdf) This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
(TN-00-22)
11/2010 Technical Note Add Email
Uprating of Semiconductors for High-Temperature Applications (pdf) Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
(TN-00-18)
05/2010 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
Proper Handling Procedures for Modules and SSDs (pdf) Includes procedures for how to properly handle modules and SSDs.
(CSN-23)
05/2013 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
Micron Validated Memory The Module Search Tool can be used in conjunction with the sections below to find information on Micron validated DDR3 SDRAM modules. 01/0001 Tool Add Email
Serial Presence Detect Micron’s SPD data conforms to JEDEC industry standards and is available through Micron’s SPD tool with your Micron module part number. 01/0001 Tool Add Email

Parts with the same Data Sheet (3)

MT36VDDF25672Y-40B ( Current ) MT36VDDF12872Y-335 MT36VDDF25672G-335 MT36VDDF25672G-40B
Part Status Production Obsolete Obsolete Obsolete
Technology DDR SDRAM DDR SDRAM DDR SDRAM DDR SDRAM
Density 2GB 1GB 2GB 2GB
RoHS Yes Yes 5/6 5/6
Comp. Count 36 36 36 36
Depth 256Mb 128Mb 256Mb 256Mb
Width x72 x72 x72 x72
Pin Count 184-pin 184-pin 184-pin 184-pin
Op Temp 0C to +70C 0C to +70C 0C to +70C 0C to +70C
Data Rate 400 MT/s 333 MT/s 333 MT/s 400 MT/s
Speed PC3200 PC2700 PC2700 PC3200
CL CL = 3 CL = 2.5 CL = 2.5 CL = 3
Voltage 2.6V 2.5V 2.5V 2.6V
Comp. Config 128 Meg x 4 64 Meg x 4 128 Meg x 4 128 Meg x 4
ECC ECC ECC ECC ECC
Module Rank Dual Rank Dual Rank Dual Rank Dual Rank
Register

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT36VDDF25672Y-40BF3 Contact Factory N/A N/A View N/A No View

Compare

Compare MT36VDDF25672Y-40B
(Recommended Part)
MT36VDDF25672Y-40BF3
Part Status Production Production
Technology DDR SDRAM DDR SDRAM
Density 2GB 2GB
RoHS Yes Yes
Comp. Count 36 36
Depth 256Mb 256Mb
Width x72 x72
Pin Count 184-pin 184-pin
Op Temp 0C to +70C 0C to +70C
Data Rate 400 MT/s 400 MT/s
Speed PC3200 PC3200
CL CL = 3 CL = 3
Voltage 2.6V 2.6V
Comp. Config 128 Meg x 4 128 Meg x 4
ECC ECC ECC
Module Rank Dual Rank Dual Rank
Register
MT36VDDF25672Y-40BJ1 Production N/A N/A View N/A No View

Compare

Compare MT36VDDF25672Y-40B
(Recommended Part)
MT36VDDF25672Y-40BJ1
Part Status Production Production
Technology DDR SDRAM DDR SDRAM
Density 2GB 2GB
RoHS Yes Yes
Comp. Count 36 36
Depth 256Mb 256Mb
Width x72 x72
Pin Count 184-pin 184-pin
Op Temp 0C to +70C 0C to +70C
Data Rate 400 MT/s 400 MT/s
Speed PC3200 PC3200
CL CL = 3 CL = 3
Voltage 2.6V 2.6V
Comp. Config 128 Meg x 4 128 Meg x 4
ECC ECC ECC
Module Rank Dual Rank Dual Rank
Register
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