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MT48LC8M16A2P-6A

Data Sheets (1)

Data Sheet
Data Sheet Updated 09/2014

Specs

Orderable Parts for: MT48LC8M16A2P-6A
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT48LC8M16A2P-6A:G Contact Factory N/A N/A N/A N/A No View

Compare

Compare MT48LC8M16A2P-6A
(Recommended Part)
MT48LC8M16A2P-6A:G
Part Status Production Production
Density 128Mb 128Mb
RoHS Yes Yes
Depth 8Mb 8Mb
Width x16 x16
Voltage 3.3V 3.3V
Package TSOP TSOP
Pin Count 54-pin 54-pin
Clock Rate 167 MHz 167 MHz
Cycle Time 6ns 6ns
Op. Temp. 0C to +70C 0C to +70C
CL CL = 3 CL = 3
Data Rate PC133 PC133
MT48LC8M16A2P-6A:L Production N/A D9NRM N/A N/A No View

Compare

Compare MT48LC8M16A2P-6A
(Recommended Part)
MT48LC8M16A2P-6A:L
Part Status Production Production
Density 128Mb 128Mb
RoHS Yes Yes
Depth 8Mb 8Mb
Width x16 x16
Voltage 3.3V 3.3V
Package TSOP TSOP
Pin Count 54-pin 54-pin
Clock Rate 167 MHz 167 MHz
Cycle Time 6ns 6ns
Op. Temp. 0C to +70C 0C to +70C
CL CL = 3 CL = 3
Data Rate PC133 PC133
Detailed Specifications
Density 128Mb Part Status Production RoHS Yes Depth 8Mb
Width x16 Voltage 3.3V Package TSOP Pin Count 54-pin
Clock Rate 167 MHz Cycle Time 6ns Op. Temp. 0C to +70C CL CL = 3
Data Rate PC133

Sim Models & Software

Sim Model (5)
Title & Description Updated Type
Verilog (zip) 03/2001 Sim Model Add Email
HSpice (zip) 2.0 (Die Rev. G) 03/2004 Sim Model Add Email
IBIS (zip) 2.2 (Die Rev. G) 06/2005 Sim Model Add Email
HSpice (zip) 2.0 (Die Rev. L) 08/2011 Sim Model Add Email
IBIS (zip) 2.0 (Die Rev. L) 08/2011 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (15)
Title & Description Updated Type
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Recommended Soldering Parameters (pdf) Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
(TN-00-15)
12/2012 Technical Note Add Email
SDRAM I/O Characteristics Comparison of 54nm to 130nm Die (pdf) This technical note compares the I/O characteristics of the 54nm to the 130nm single data rate (SDR) synchronous dynamic random access memory (SDRAM) die.
(TN-00-24)
08/2011 Technical Note Add Email
Bypass Capacitor Selection for High-Speed Designs (pdf) Describes bypass capacitor selection for high-speed designs.
(TN-00-06)
03/2011 Technical Note Add Email
Micron Wire-Bonding Techniques (pdf) This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
(TN-00-22)
11/2010 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
DRAM Design Analysis Kits (html) The platform-independent storage module PISMO™ specifications address these issues by providing a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email

Parts with the same Data Sheet (37)

MT48LC8M16A2P-6A ( Current ) MT48LC16M8A2BB-75 MT48LC16M8A2BB-75 IT MT48LC16M8A2BB-7E MT48LC16M8A2FB-75 MT48LC16M8A2FB-75 IT MT48LC16M8A2P-75 MT48LC16M8A2P-75 IT MT48LC16M8A2P-75 L MT48LC16M8A2P-7E MT48LC16M8A2TG-75 MT48LC16M8A2TG-75 IT MT48LC32M4A2P-75 MT48LC8M16A2B4-75 MT48LC8M16A2B4-75 IT MT48LC8M16A2F4-75 MT48LC8M16A2F4-75 IT MT48LC8M16A2P-6A IT MT48LC8M16A2P-75 MT48LC8M16A2P-75 IT MT48LC8M16A2P-75 L MT48LC8M16A2P-7E MT48LC8M16A2P-7E IT MT48LC8M16A2TG-6A MT48LC8M16A2TG-6A IT MT48LC8M16A2TG-75 MT48LC8M16A2TG-75 IT MT48LC8M16A2TG-75 L MT48LC8M16A2TG-7E MT48LC8M16A2TG-7E IT MT48LC16M8A2P-6A MT48LC8M16A2B4-6A MT48LC8M16A2B4-6A IT MT48LC8M16A2F4-6A MT48LC8M16A2F4-6A IT MT48LC8M16A2P-6A XIT MT48LC16M8A2BB-6A XIT MT48LC8M16A2B4-6A XIT
Part Status Production Contact Factory Contact Factory Obsolete Obsolete Obsolete Contact Factory Contact Factory Obsolete Production Contact Factory Contact Factory Contact Factory End of Life Contact Factory Obsolete End of Life Production Contact Factory Contact Factory Contact Factory Production Production Obsolete Contact Factory Contact Factory Contact Factory Obsolete Contact Factory Contact Factory Production Production Production Contact Factory Contact Factory Production Production Production
Density 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb 128Mb
RoHS Yes Yes Yes Yes 5/6 5/6 Yes Yes Yes Yes 5/6 5/6 Yes Yes Yes 5/6 5/6 Yes Yes Yes Yes Yes Yes 5/6 5/6 5/6 5/6 5/6 5/6 5/6 Yes Yes Yes 5/6 5/6 Yes Yes Yes
Depth 8Mb 16Mb 16Mb 16Mb 16Mb 16Mb 16Mb 16Mb 16Mb 16Mb 16Mb 16Mb 32Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 8Mb 16Mb 8Mb 8Mb 8Mb 8Mb 8Mb 16Mb 8Mb
Width x16 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x8 x4 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x16 x8 x16 x16 x16 x16 x16 x8 x16
Voltage 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Package TSOP FBGA FBGA FBGA FBGA FBGA TSOP TSOP TSOP TSOP TSOP TSOP TSOP VFBGA VFBGA VFBGA VFBGA TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP TSOP VFBGA VFBGA VFBGA VFBGA TSOP FBGA VFBGA
Pin Count 54-pin 60-ball 60-ball 60-ball 60-ball 60-ball 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-ball 54-ball 54-ball 54-ball 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-pin 54-ball 54-ball 54-ball 54-ball 54-pin 54-ball 54-ball
Clock Rate 167 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 167 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 167 MHz 166 MHz 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz 166 MHz 167 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz
Cycle Time 6ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 6ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 6ns 7.5ns 7.5ns 7.5ns 7.5ns 7.5ns 6ns 6ns 6ns 6ns 6ns 6ns 6ns 6ns
Op. Temp. 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C -40C to +85C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C 0C to +70C -40C to +85C 0C to +70C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
CL CL = 3 CL = 3 CL = 3 CL = 2 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 2 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 2 CL = 2 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 2 CL = 2 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3 CL = 3
Data Rate PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133 PC133

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT48LC8M16A2P-6A:G Contact Factory N/A N/A N/A N/A No View

Compare

Compare MT48LC8M16A2P-6A
(Recommended Part)
MT48LC8M16A2P-6A:G
Part Status Production Production
Density 128Mb 128Mb
RoHS Yes Yes
Depth 8Mb 8Mb
Width x16 x16
Voltage 3.3V 3.3V
Package TSOP TSOP
Pin Count 54-pin 54-pin
Clock Rate 167 MHz 167 MHz
Cycle Time 6ns 6ns
Op. Temp. 0C to +70C 0C to +70C
CL CL = 3 CL = 3
Data Rate PC133 PC133
MT48LC8M16A2P-6A:L Production N/A D9NRM N/A N/A No View

Compare

Compare MT48LC8M16A2P-6A
(Recommended Part)
MT48LC8M16A2P-6A:L
Part Status Production Production
Density 128Mb 128Mb
RoHS Yes Yes
Depth 8Mb 8Mb
Width x16 x16
Voltage 3.3V 3.3V
Package TSOP TSOP
Pin Count 54-pin 54-pin
Clock Rate 167 MHz 167 MHz
Cycle Time 6ns 6ns
Op. Temp. 0C to +70C 0C to +70C
CL CL = 3 CL = 3
Data Rate PC133 PC133
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