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MT46H16M32LFB5-5 IT

Data Sheets (1)

Data Sheet
Data Sheet Updated 02/2014

Specs

Orderable Parts for: MT46H16M32LFB5-5 IT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT46H16M32LFB5-5 IT:C Production N/A D9LQV N/A N/A No N/A
Detailed Specifications
Technology Mobile LPDDR Density 512Mb Part Status Production RoHS Yes
Depth 16Mb Width x32 Voltage 1.8V Package VFBGA
Pin Count 90-ball Clock Rate 200 MHz Data Rate LPDDR400 Cycle Time 5ns
Op. Temp. -40C to +85C Brand Micron

Sim Models & Software

Sim Model (3)
Title & Description Updated Type
HSpice: 512Mb Mobile LPDDR T67M (zip) 2.0 (Die Rev. C) 10/2010 Sim Model Add Email
IBIS: 512Mb Mobile LPDDR T67M (zip) 2.0 (Die Rev. C) 10/2010 Sim Model Add Email
LPDDR Verilog Model (zip) 6.05 04/2011 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (19)
Title & Description Updated Type
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Partial Array Self Refresh (PASR) (pdf) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.
(E0597E10)
02/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Deep Power Down (DPD) (pdf) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.
(E0598E21)
02/2014 Technical Note Add Email
Technical Note: Recommended Soldering Conditions & Storage Conditions (pdf) This document shows referential examples of recommended soldering and storage conditions for DRAM products provided by Elpida Memory, Inc.
(E0591E22)
02/2014 Technical Note Add Email
Technical Note: Low-Power Function of Mobile RAM - Auto Temperature Compensated Self Refresh (ATCSR) (pdf) This technical note describes Auto Temperature Compensated Self Refresh (ATCSR), one of the low-power functions that have been adapted to Mobile DRAM.
(E0599E20)
02/2014 Technical Note Add Email
See All Results
Customer Service Note (5)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
DRAM Design Analysis Kits (html) The platform-independent storage module PISMO™ specifications address these issues by providing a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email

Parts with the same Data Sheet (9)

MT46H16M32LFB5-5 IT ( Current ) MT46H32M16LFBF-5 AIT MT46H32M16LFBF-5 IT MT46H32M16LFBF-6 AIT MT46H32M16LFBF-6 IT MT46H16M32LFBQ-5 AIT MT46H16M32LFBQ-5 AAT MT46H16M32LFB5-6 AIT MT46H16M32LFB5-6 IT MT46H32M16LFBF-6 AAT
Part Status Production Production Production Production Production Production Production Production Production Production
Technology Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR Mobile LPDDR
Density 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb
RoHS Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
Depth 16Mb 32Mb 32Mb 32Mb 32Mb 16Mb 16Mb 16Mb 16Mb 32Mb
Width x32 x16 x16 x16 x16 x32 x32 x32 x32 x16
Voltage 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V
Package VFBGA VFBGA VFBGA VFBGA VFBGA WFBGA VFBGA VFBGA VFBGA VFBGA
Pin Count 90-ball 60-ball 60-ball 60-ball 60-ball 90-ball 90-ball 60-ball
Clock Rate 200 MHz 200 MHz 200 MHz 167 MHz 167 MHz 200 MHz 200 MHz 167 MHz 167 MHz 167 MHz
Data Rate LPDDR400 LPDDR400 LPDDR400 LPDDR333 LPDDR333 LPDDR400 LPDDR400 LPDDR333 LPDDR333 LPDDR333
Cycle Time 5ns 5ns 5ns 6ns 6ns 5ns 5ns 6ns 6ns 6ns
Op. Temp. -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +105C -40C to +85C -40C to +85C -40C to +105C
Brand Micron Micron Micron Micron Micron Micron Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT46H16M32LFB5-5 IT:C Production N/A D9LQV N/A N/A No N/A
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