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MT47H32M16HR-25E

Data Sheets (1)

Data Sheet
Data Sheet Updated 04/2014

Specs

Orderable Parts for: MT47H32M16HR-25E
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT47H32M16HR-25E:G Contact Factory N/A D9LPX N/A N/A No View

Compare

Compare MT47H32M16NF-25E
(Recommended Part)
MT47H32M16HR-25E:G
Part Status Contact Factory Production Contact Factory
Density 512Mb 512Mb 512Mb
RoHS Yes Yes Yes
Depth 32Mb 32Mb 32Mb
Width x16 x16 x16
Voltage 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA
Pin Count 84-ball 84-ball 84-ball
Clock Rate 400 MHz 400 MHz 400 MHz
Cycle Time 2.5ns 2.5ns 2.5ns
Op. Temp. 0C to +85C 0C to +85C 0C to +85C
CL CL = 5 CL = 5 CL = 5
Data Rate DDR2-800 DDR2-800 DDR2-800
Detailed Specifications
Density 512Mb Part Status Contact Factory RoHS Yes Depth 32Mb
Width x16 Voltage 1.8V Package FBGA Pin Count 84-ball
Clock Rate 400 MHz Cycle Time 2.5ns Op. Temp. 0C to +85C CL CL = 5
Data Rate DDR2-800

Sim Models & Software

Sim Model (3)
Title & Description Updated Type
512Mb DDR2 Verilog Model (zip) 5.83 04/2010 Sim Model Add Email
HSpice (zip) 2.0 (Die Rev. G) 08/2010 Sim Model Add Email
IBIS (zip) 2.1 (Die Rev. G) 04/2013 Sim Model Add Email

RoHS Certificates

Title & Description Updated Type
RoHS Certificate of Compliance (PDF) Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive. 12/2014 RoHS Certification Add Email
China RoHS Certificate (PDF) Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products. 12/2014 RoHS Certification Add Email

Documentation & Support

Technical Note (29)
Title & Description Updated Type
SEMI Wafer Map Format (pdf) Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files.
(TN-00-21)
03/2014 Technical Note Add Email
Technical Note: DDR2 SDRAM Technology (pdf) This document describes new functions that have been added to DDR2 SDRAM.
(E0678E10)
02/2014 Technical Note Add Email
Technical Note: New Function of DDR2 SDRAM - On-Die Termination (ODT) (pdf) This document describes On-Die Termination (ODT), a new function that has been added to DDR2 SDRAM.
(E0593E20)
02/2014 Technical Note Add Email
Technical Note: Recommended Soldering Conditions & Storage Conditions (pdf) This document shows referential examples of recommended soldering and storage conditions for DRAM products provided by Elpida Memory, Inc.
(E0591E22)
02/2014 Technical Note Add Email
Technical Note: New Function of DDR2 SDRAM - Off-Chip Driver (OCD) (pdf) This document describes Off-Chip Driver (OCD), a new function that has been added to DDR2 SDRAM.
(E0594E20)
02/2014 Technical Note Add Email
See All Results
Customer Service Note (4)
Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
10/2014 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
03/2014 Customer Service Note Add Email
PCN/EOL Systems (pdf) Explains Micron's product change notification and end-of-life systems.
(CSN-12)
04/2012 Customer Service Note Add Email

Tool (2)
Title & Description Updated Type
DRAM Design Analysis Kits (html) The platform-independent storage module PISMO™ specifications address these issues by providing a standard for convenient, interchangeable memory test boards. PISMO boards significantly reduce design inefficiencies, providing a huge benefit for the short development cycles of consumer products. 10/2008 Tool Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 01/0001 Tool Add Email

Parts with the same Data Sheet (18)

MT47H32M16HR-25E ( Current ) MT47H128M4CF-25E MT47H32M16HR-187E MT47H32M16HR-25E IT MT47H32M16HR-25E L MT47H32M16HW-25E MT47H32M16HW-25E IT MT47H64M8CF-25E MT47H64M8CF-25E IT MT47H64M8CF-25E L MT47H64M8JN-25E MT47H64M8JN-25E IT MT47H128M4SH-25E MT47H64M8SH-187E MT47H64M8SH-25E MT47H32M16NF-25E MT47H32M16NF-187E MT47H64M8SH-25E IT MT47H32M16NF-25E IT
Part Status Contact Factory Contact Factory End of Life Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Contact Factory Production Production Production Production Production Production Production
Density 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb 512Mb
RoHS Yes Yes Yes Yes Yes 5/6 5/6 Yes Yes Yes 5/6 5/6 Yes Yes Yes Yes Yes Yes Yes
Depth 32Mb 128Mb 32Mb 32Mb 32Mb 32Mb 32Mb 64Mb 64Mb 64Mb 64Mb 64Mb 128Mb 64Mb 64Mb 32Mb 32Mb 64Mb 32Mb
Width x16 x4 x16 x16 x16 x16 x16 x8 x8 x8 x8 x8 x4 x8 x8 x16 x16 x8 x16
Voltage 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA
Pin Count 84-ball 60-ball 84-ball 84-ball 84-ball 84-ball 84-ball 60-ball 60-ball 60-ball 60-ball 60-ball 60-ball 60-ball 60-ball 84-ball 84-ball 60-ball 84-ball
Clock Rate 400 MHz 400 MHz 533 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz 400 MHz 333 MHz 533 MHz 400 MHz 400 MHz 533 MHz 400 MHz 400 MHz
Cycle Time 2.5ns 2.5ns 1.875ns 2.5ns 2.5ns 2.5ns 2.5ns 2.5ns 2.5ns 2.5ns 2.5ns 2.5ns 3ns 1.875ns 2.5ns 2.5ns 1.875ns 2.5ns 2.5ns
Op. Temp. 0C to +85C 0C to +85C 0C to +85C -40C to +95C 0C to +85C 0C to +85C -40C to +95C 0C to +85C -40C to +95C 0C to +85C 0C to +85C -40C to +95C 0C to +85C 0C to +85C 0C to +85C 0C to +85C 0C to +85C -40C to +95C -40C to +95C
CL CL = 5 CL = 5 CL = 7 CL = 5 CL = 5 CL = 5 CL = 5 CL = 5 CL = 5 CL = 5 CL = 5 CL = 5 CL = 5 CL = 7 CL = 5 CL = 5 CL = 7 CL = 5 CL = 5
Data Rate DDR2-800 DDR2-800 DDR2-1066 DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-800 DDR2-667 DDR2-1066 DDR2-800 DDR2-800 DDR2-1066 DDR2-800 DDR2-800

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT47H32M16HR-25E:G Contact Factory N/A D9LPX N/A N/A No View

Compare

Compare MT47H32M16NF-25E
(Recommended Part)
MT47H32M16HR-25E:G
Part Status Contact Factory Production Contact Factory
Density 512Mb 512Mb 512Mb
RoHS Yes Yes Yes
Depth 32Mb 32Mb 32Mb
Width x16 x16 x16
Voltage 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA
Pin Count 84-ball 84-ball 84-ball
Clock Rate 400 MHz 400 MHz 400 MHz
Cycle Time 2.5ns 2.5ns 2.5ns
Op. Temp. 0C to +85C 0C to +85C 0C to +85C
CL CL = 5 CL = 5 CL = 5
Data Rate DDR2-800 DDR2-800 DDR2-800
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