Manufacturing Photos

Micron Manufacturing Photos

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300mm Fabrication Photos

	A Front Opening Unified Pod (FOUP) delivers 300mm wafers securely to a tool for processing or measurement. Low-resolution image High-resolution image
	Technicians work in a production bay within a 300mm fabrication clean room. Low-resolution image High-resolution image
	A diffusion engineer manages equipment inside a 300mm fabrication clean room. Low-resolution image High-resolution image
	A photolithography bay within a 300 mm fabrication clean room. Low-resolution image High-resolution image
	A production bay within a 300mm fabrication clean room that includes wet etch equipment (left) and dry etch equipment (right). Low-resolution image High-resolution image

The Manufacturing Process

	Implant Process step where wafers are bombarded with ions called dopants, creating the positive and negative areas on the wafer. Low-resolution image High-resolution image
	Maintenance Corridor Technicians service and maintain equipment without entering the fabrication bays. Low-resolution image High-resolution image
	Wafer Saw Diamond-edged blade cuts the finished wafer into individual die. Low-resolution image High-resolution image
	Ambyx™ Intelligent Burn-In Ovens 100% monitored burn-in simulates actual usage, subjecting each part to varying voltages and temperatures to determine long-term quality and reliability. Low-resolution image High-resolution image
	Photo Area Fabrication area corridor. Low-resolution image High-resolution image
	Inspecting Wafer Team member visually inspecting a wafer. Low-resolution image High-resolution image
	Fab After the circuitry pattern is etched onto the wafer, excess material is removed. Low-resolution image High-resolution image
	CVD In the CVD (Chemical Vapor Deposition) area, thin films are deposited or grown on the wafer. Low-resolution image High-resolution image
	Laser A laser marker scribes information such as product type, date, speed, etc., on to the package surface of each device (integrated circuit). Low-resolution image High-resolution image
	Test Floor The equipment on the right side is a bank of handlers. These machines socket the devices into the tester for parametric, functional and speed testing. The equipment on the left are binners which transfer devices based on the test grading to the appropriate trays for further processing. Low-resolution image High-resolution image
	SIG Pick and Place machines are loaded with components according to the build program. The heads inside the machine pick the components out of the feeders using vacuum nozzles. The components are placed on printed circuit boards. Low-resolution image High-resolution image

Image Gallery