Semiconductor Manufacturing: Test/Burn-In
Each
memory chip is tested at various stages in the manufacturing process to see
how fast it can store or retrieve information, including the high temperature
burn-in test. There chips are subjected to varying voltages and temperatures
to determine their long-term quality and reliability and to eliminate weak chips.
Simulating actual usage, Micron's proprietary AMBYX™ ovens run monitored performance tests on every chip. This helps to guarantee the reliability of the parts customers receive and reduces overall test time and production costs.
Marking/Scanning
Each chip is marked with identifying information. Chips pass under a laser, which etches the product type, date, and speed onto the surface of the package.
Each chip is then scanned to ensure that the package and leads meet industry standards. Optics or lasers examine the chips to identify defects.
Finished Goods
Parts are prepared for shipment according to customer needs. For example, customers who put the chips on boards or modules prefer them placed in equidistant pockets on a tape and spooled on a reel for automated product assembly. Other customers want parts packaged in antistatic tubes or trays.
The product is prepared for courier pickup and shipped to computer, peripheral, telecommunications, and transportation customers throughout the world.
In the last 30 years semiconductors have become virtually indispensable in many aspects of daily life. Even people who do not own or use a computer are likely to use semiconductor memory in one way or another.
Many of the fantastic capabilities of our modern world are possible thanks to the semiconductor memory chip.