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Math in the Workplace: Overview

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Math in the Work Place

Math in the Workplace - Algebra

MICRON TECHNOLOGY, INC.,

Semiconductor Manufacturing
Quality Control

 

 Job Description: Develop wafer level test strategies and test programs. Provide failure analysis reporting. Monitor device yields, failure rates, and repair rates. Interact with various engineering and product groups to optimize device yields and minimize costs.
   


Problem:

wafer CTEThe CTE (Center to Edge) range of the readings taken of the center of a wafer and various points on the edge of a wafer after Chemical Mechanical Planarization (CMP) must be calculated and compared with a critical value to determine if the process is accurate. The critical value is 1000.

Determine whether Process A and Process B are accurate (absolute value is less than 1000).

X1 X2 X3 X4 X5
Process A 22000 23500 21000 24000 21500
Process B 17000 19000 20000 21000 19700

CTE = bracket X1 + X3 + X4 + X5
line
4		 - X2 bracket

solution

 

 

 

 

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Solution:

wafer CTEThe CTE range is calculated by finding the difference between the average or mean of the readings taken on the edge of the wafer with the reading taken in the center.

CTE = bracket X1 + X3 + X4 + X5
line
4		 - X2 bracket

X1 X2 X3 X4 X5
Process A 22000 23500 21000 24000 21500
Process B 17000 19000 20000 21000 19700

CTEA = bracket 22000 + 21000 + 24000 + 21500
line
4		 - 23500bracket = -1375

CTEB = bracket 17000 + 20000 + 21000 + 19700
line
4		 - 19000bracket = 425

Process B is accurate because it has a CTE range less than the critical value of 1000.