Our Innovations Blog highlights a few of our recent technology developments–from advanced storage solutions developed by our MAST Center team, to the cutting edge of Server, Computing, and Mobile memory.
Micron Innovations Blog
Our research scientists are some of the best in the world--as evidenced by our industry-leading process technology and breakthrough designs. Learn more about how our innovations are driving advancements in NAND and DRAM manufacturing.
Leading Process Technology
Our proprietary Displaytech FLCOS technology switches pixels with incredible speed, enabling us to build sequential color images with bright, vibrant colors and sharp edge clarity.
FLCOS Microdisplay Technology
Servers in data centers worldwide use substantial electrical energy. To address global power consumption, Micron has developed an energy-efficient line of DRAM products targeted at these power hungry data centers.
Osmium technology, with its unique blend of patented and advanced wafer-level packaging technologies, delivers extremely high density semiconductor solutions in ultra-small form factors.
Osmium™ Packaging Technology
Requirements for smaller form factors and higher memory densities are fueling the need for bare die memory solutions due to their superior flexibility.
Bare Die
The primary objective of Micron Ventures is to assist Micron Technology in supporting the long-term needs of its customers in the communications, automotive, medical, computing, and consumer electronics markets.
Micron Ventures
