Does Micron offer product in whole wafer form and singulated die?
Micron primarily offers bare die product in singulated die form. These die are shipped on a metal film frame with only 'good' probed dice. Customers do not need to worry about wafer maps because they receive only good probed die. For more information on singlated die, please see 
TN-00-16.
When ordering whole wafers, wafer maps will be provided in each shipment. For more information on wafer mapping, please see TN-00-21.
What wafer thickness options does Micron offer?
Standard ‘unground’ wafer thickness for wafers is 29 mils (750µm). Micron offers additional wafer thickness options of 18.5 mils or 12 mils, depending on the product. Please see the applicable die data sheet for die thickness options beyond the standard thickness. Depending on customer demand, Micron may consider processing alternative thicknesses. Please consult your sales representative for more information.
Need a bare die data sheet?
Access to Micron’s bare die data sheets requires a nondisclosure form (NDA) and is subject to Micron's prior approval. To request access to all of the technical information available, set up a micron.com account now. It only takes a few minutes to request access.
How does Micron ship product?
Singulated die are shipped in metal film frames. See TN-00-16.
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