What wafer thickness options does Micron offer?
Standard "unground" wafer thickness is 750µm for 200mm wafers and 790µm for 300mm wafers. Micron offers additional wafer thickness options for 200mm wafers, depending on the product. Please see the applicable die data sheet for die thickness options beyond the standard thickness. Depending on customer demand, Micron may consider processing alternative thicknesses. Please consult your sales representative for more information.
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