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News
11/03/2009	Micron Introduces New NAND and Low-Power DRAM Multi-Chip Packages Built on the Industry’s Most Advanced Processes
10/19/2009	Micron Introduces New Line of 34nm Multi-Level Cell NAND for Enterprise Storage Systems, Providing 6x the Endurance
08/11/2009	Intel, Micron Achieve Industry’s Most Efficient NAND Product Using 3-Bit-Per-Cell Technology
07/30/2009	Micron Introduces a New Way to Increase Server Memory Capacity and Improve Performance
07/27/2009	IDT and Micron Form Alliance to Develop PCI Express® Enterprise Solid-State Drive Solutions
06/30/2009	Micron Introduces New 34-Nanometer High-Density NAND Products, Increasing Performance and Reducing Die Size
06/18/2009	Micron Brings High-Performance, Low-Power DDR3 Memory to Notebook Computers
06/10/2009	Micron Brings Enhanced Security and NAND Partition Management to Mobile Applications
05/20/2009	Micron Technology Introduces New Single-Chip Microdisplay Panel
04/08/2009	Micron’s DDR3 Server Memory Validated with Intel’s Next-Generation Intel® Xeon® Processors
04/01/2009	Micron Wins Prestigious Semiconductor Insight Awards for DRAM and NAND Flash Technology Innovations
03/17/2009	Micron Recognized By Semiconductor Insights for Innovations in NAND Flash and DRAM Technology
03/11/2009	Micron Announces Industry’s Highest Density Block Abstracted NAND Flash Memory Portfolio
02/12/2009	Micron Introduces Suite of NAND Software Solutions for Mobile Applications
02/12/2009	Micron Introduces High-Performance, Mobile Low-Power DDR2 Memory for Mobile Applications
02/12/2009	Micron Leverages 34-Nanometer NAND Process to Produce Highest Density Multi-Chip Package for High-End Mobile Phones
02/12/2009	Micron and Nanya Develop Low-Power DDR2 for Mobile Applications

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