Featured Videos

Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

View video
Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

View video

About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

Learn more
Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

Welcome to My Workspace!

Create an account to access these benefits:

  • Save part pages
  • Save Data Sheets and other files
  • Create folders to organize your projects
  • Share folders with colleagues
  • Organize secure documents for easy access
  • "Follow" parts to see alerts and updates

Learn more about Workspace features

Don't have an account yet? Sign up

Already have an account?   Login

My Folders

Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

HMC Is Here Part 3 Standard Page Save
My Workspace

HMC Arrives Just in Time to Be Your New Standard for Memory Performance: Part 3

Tom Kinsley   |   November 20, 2013   |   All Products

Back again with part 3 of my blog series outlining the features and benefits of Micron’s HMCMy last post covered HMC’s abstracted memory management, simplified and scalable interface, and superior performance.  Let’s finish up by discussing these additional key features:

Uncomplicated Board Layout and Dense Package

Our short-reach (SR) HMC device comes in two packages: the four-link, 31mm x 31mm package and the smaller two-link, 16mm x 19.5mm package, which are each available in 2GB and 4GB densities. Depending on the number of links routed and the configuration of each link (each link can be configured for different widths), the HMC can have as few as 34 and up to 66 active signals per channel and four additional active signals per cube. As such, fewer signals need to be routed, and it’s easy to route them on standard FR4 material with the good return/insertion loss of the PHY, full-lane reversal, and lane polarity options. HMC’s routing is not only simple and scalable to exact density or bandwidth requirements, its small packages also take up very little real estate on the PCB.

Exceptional RAS Features

Some of the more well-known reliability, availability, and serviceability (RAS) features of the cube are the robust 32-bit cyclic redundancy check (CRC) protection and packet retry mechanisms over the external channels.  But several other significant features set HMC apart, including: built-in self-tests (BISTs) and memory scrubbing that detect and repair soft and hard memory or potential through-silicon via (TSV) failures; internal thermal sensing that optimizes refresh control; error status registers with status flags; and reporting options through either in-band or two-sided band channels.  Basically, we’ve built all of the default functions (and more) of a mission-critical CPU into the HMC device, which helps reduce the overall cost of silicon for the system.


While HMC may cost more than an equivalent-density DDRx module, let’s look at the upside. In addition to all of the benefits already discussed, at like-bandwidth, HMC requires less ASIC or CPU silicon, enables the overall system to consume less power—which also equates to lower cooling costs—and, thanks to HMC’s on-device RAS features, experiences a higher percentage of uptime without high service or replacement costs for defective memory.

Stable Technology and Long-Term Support   

With traditional memory, system designers often ask, “Why does the memory interface keep changing every three to four years?” With HMC, it’s different! Micron and the HMCC are working on next-generation HMC product lines with the goal of keeping future devices as compatible as possible with older devices. Next-generation HMC products will support higher-density and faster PHYs while using the same protocol, side-band channels, internal register, and addressing—and still be totally independent to the memory technology within. And because many of our customers need long-term memory support, and just like SDR, our HMC will be supported in the long term.

The Time is Now

If you need real memory bandwidth, mission-critical reliability, reusable IP, and year-over-year savings—and need it all nowcontact us today to see how HMC can help take your design to the next level. 

And come talk to us at SC13—and see our HMC live demos—on November 18-21, in Denver, CO, at booth 1322.

Login or Sign-up for an account to leave a comment.